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K4A8G165WC-BCTD
8Gbit 1.14V~1.26V 1.333GHz DDR4 SDRAM FBGA-96 Memory (ICs) RoHS
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規格
| Packaging | FBGA-96 |
| Clock Frequency | 1.333GHz |
| Memory Format | DDR4 SDRAM |
| Memory Size | 8Gbit |
| Operating temperature | 0℃~+95℃ |
| Voltage - Supply | 1.14V~1.26V |
概述
Description
K4A8G165WC-BCTD is a DRAM (Dynamic Random-Access Memory) module produced by Samsung, specifically a 4Gb (gigabit) DDR3 SDRAM chip. It is typically used in various applications, including consumer electronics, computers, and embedded systems. This memory component operates at a standard voltage of 1.5V and supports data rates of up to 1600 MT/s (Megatransfers per second), making it suitable for high-performance computing tasks.
The 'K4A8G165' part number indicates it is organized as 512Mb x 8 bits, while the 'BCTD' suffix usually refers to specific packaging and temperature range characteristics. DDR3 memory is known for its improved performance and efficiency over its predecessors, making it a popular choice for a wide range of devices. When integrating this memory, it is essential to consider compatibility with the motherboard and other components to ensure optimal performance.
The 'K4A8G165' part number indicates it is organized as 512Mb x 8 bits, while the 'BCTD' suffix usually refers to specific packaging and temperature range characteristics. DDR3 memory is known for its improved performance and efficiency over its predecessors, making it a popular choice for a wide range of devices. When integrating this memory, it is essential to consider compatibility with the motherboard and other components to ensure optimal performance.
Features
The K4A8G165WC-BCTD is a 2GB DDR3 SDRAM memory chip produced by Samsung, primarily used in mobile and embedded applications. Key features include:
1. Density: 2GB capacity, suitable for various memory-intensive tasks.
2. Technology: DDR3 SDRAM technology, offering improved performance over DDR2, with higher data rates and lower power consumption.
3. Speed: Typically operates at speeds of 1066 MT/s to 1600 MT/s, ensuring efficient data transfer.
4. Voltage: Operates at a low voltage of 1.5V, enhancing power efficiency.
5. Form Factor: Available in a compact package, making it ideal for space-constrained designs.
6. Data Width: 16-bit data width, allowing for efficient data handling in applications.
7. Applications: Commonly used in smartphones, tablets, and other mobile devices.
This memory chip balances performance, efficiency, and size, making it suitable for modern electronics requiring dependable memory solutions.
1. Density: 2GB capacity, suitable for various memory-intensive tasks.
2. Technology: DDR3 SDRAM technology, offering improved performance over DDR2, with higher data rates and lower power consumption.
3. Speed: Typically operates at speeds of 1066 MT/s to 1600 MT/s, ensuring efficient data transfer.
4. Voltage: Operates at a low voltage of 1.5V, enhancing power efficiency.
5. Form Factor: Available in a compact package, making it ideal for space-constrained designs.
6. Data Width: 16-bit data width, allowing for efficient data handling in applications.
7. Applications: Commonly used in smartphones, tablets, and other mobile devices.
This memory chip balances performance, efficiency, and size, making it suitable for modern electronics requiring dependable memory solutions.
Package
The K4A8G165WC-BCTD is a DRAM memory chip packaged in a 96-ball FBGA (Fine Ball Grid Array) format. This packaging allows for efficient space utilization and thermal performance in electronic devices.
Pinout
The K4A8G165WC-BCTD is a 4GB DDR3 SDRAM memory chip with a pin count of 78. It is designed for use in mobile applications and operates at a voltage of 1.2V, featuring a data rate of up to 1600 MT/s.
Key functions of the K4A8G165WC-BCTD include:
1. Memory Storage: It serves as volatile memory for devices, allowing for temporary data storage during operation.
2. Data Transfer: Facilitates high-speed data transfers due to its DDR (Double Data Rate) design.
3. Latency: It has lower latency compared to older memory technologies, enhancing overall performance in mobile devices.
4. Power Efficiency: Operates at lower power levels, making it suitable for battery-powered devices.
This chip is commonly used in smartphones, tablets, and other portable electronics.
Key functions of the K4A8G165WC-BCTD include:
1. Memory Storage: It serves as volatile memory for devices, allowing for temporary data storage during operation.
2. Data Transfer: Facilitates high-speed data transfers due to its DDR (Double Data Rate) design.
3. Latency: It has lower latency compared to older memory technologies, enhancing overall performance in mobile devices.
4. Power Efficiency: Operates at lower power levels, making it suitable for battery-powered devices.
This chip is commonly used in smartphones, tablets, and other portable electronics.
Manufacturer
The K4A8G165WC-BCTD is manufactured by Samsung Electronics, a South Korean multinational conglomerate. Samsung is primarily known for its consumer electronics, including smartphones, televisions, and home appliances, but it also has a significant presence in the semiconductor industry. The company produces a wide range of components, including DRAM, NAND flash memory, and system-on-chip solutions, which are used in various electronic devices. Founded in 1938, Samsung has grown to become one of the largest technology companies globally, recognized for its innovation and quality in both consumer products and semiconductor manufacturing.
Application
The K4A8G165WC-BCTD is a DRAM memory chip commonly used in mobile devices, tablets, and laptops. Its application areas include high-performance computing, data storage, and memory expansion in consumer electronics. It is also utilized in automotive applications and IoT devices, where efficient power consumption and high-speed data processing are crucial.
Equivalent
The K4A8G165WC-BCTD is a 1GB DDR3 SDRAM chip. Equivalent products include:
1. K4A8G165WB-BCTD
2. Hynix H5TQ2G83AFR
3. Micron MT41K256M16HA
4. Samsung K4B4G1646F
These alternatives should match in specifications such as density, data rate, and package type. Always verify compatibility before replacement.
1. K4A8G165WB-BCTD
2. Hynix H5TQ2G83AFR
3. Micron MT41K256M16HA
4. Samsung K4B4G1646F
These alternatives should match in specifications such as density, data rate, and package type. Always verify compatibility before replacement.
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