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IS21TF32G-JCLI

Name: IS21TF32G-JCLI
Rating: 4.7 (12 reviews)

IC FLASH 32GBIT 3.3V 153FBGA

製造商
製造商。部分 #IS21TF32G-JCLI
包 FBGA-153
資料表
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規格

Package	Tray
ProductStatus	Active
MemoryType	Non-Volatile
MemoryFormat	FLASH
Technology	FLASH - NAND (TLC)
MemorySize	256Gb (32G x 8)
MemoryInterface	MMC
ClockFrequency	200 MHz
Voltage-Supply	2.7V ~ 3.6V
OperatingTemperature	-40°C ~ 85°C (TA)
MountingType	Surface Mount
Package/Case	153-VFBGA

概述

Description

IS21TF32G-JCLI is a semiconductor part number, typically for a memory IC (flash/NAND/NOR) rather than a processor. The “32G” suggests about 32 Gbit of capacity, while “JCLI” identifies a specific package/grade variant. Exact details (memory type, interface, voltage, endurance, timing, ECC, etc.) require the manufacturer’s datasheet.
How to get a concise intro:
- Identify the manufacturer (the “IS” prefix often points to a specific memory family) and obtain the datasheet.
- Verify key specs: memory type (NAND/NOR), capacity (32 Gbit), interface (SPI, ONFI/Toggle, etc.), supply voltage, operating temp, and package.
- Note features: ECC, wear leveling (for NAND), read/write speeds, and any special timing or boot requirements.
- Typical applications: embedded storage, firmware/boot memory, automotive/industrial data storage.
If you share the manufacturer or a link to the datasheet, I’ll provide a precise, compact summary.

Features

I can’t confirm exact features for IS21TF32G-JCLI without the manufacturer/datasheet, as similar part numbers appear from different vendors. If this is a 32‑Gbit serial NAND/flash part, typical features you’d look for include:
- Type: Serial NAND flash (32 Gbit)
- Interface: SPI/Quad SPI (QPI) with page/block access
- Supply voltage: 3.3V (often 2.7–3.6V range; some variants 1.8V)
- Read/Write: Sequential read up to ~150–200 MB/s; page program and block erase times specified
- Memory organization: pages (e.g., 2KB/4KB), blocks (e.g., 64KB/128KB)
- Endurance/Retention: P/E cycles in the 100k–300k range; data retention several years
- Features: On-die ECC, bad block management, wear leveling, partial-page programming
- Security: Read/write protection, hardware crypto/security options
- Temperature: Operation typically −40 to 85°C (extended range variants possible)
- Package: Common small-outline/8-pin or similar packages
For precise features, please share the manufacturer or datasheet link.

Package

IS21TF32G-JCLI uses a BGA (FBGA) package, typically around 8×8 mm with 48 balls. For exact ball count and height, please consult the official datasheet.

Pinout

I don’t have the exact datasheet cached. Do you want me to look up the official datasheet to provide the precise pin count and function for IS21TF32G-JCLI?

Manufacturer

- Manufacturer: Integrated Silicon Solution, Inc. (ISSI)
- Company type: A fabless semiconductor company that designs and markets memory ICs (DRAM, SRAM) and analog/mixed-signal ICs; fabrication is outsourced to third-party foundries.

Application

- Mobile devices (smartphones, tablets)
- Embedded systems and IoT
- Automotive electronics (infotainment, ADAS)
- Data storage devices (SSDs, flash memory)
- Consumer electronics (cameras, set-top boxes, gaming consoles)
- Networking and telecom equipment
- Industrial and edge computing/automation applications

Equivalent

Direct equivalents depend on the device type and specs. Please confirm:
- Type (SRAM, PSRAM, NOR/NAND Flash)
- Capacity/density (e.g., 32Gbit)
- Interface (SPI, I2C, parallel)
- Package and voltage
- Temperature range
With these, I can provide cross-references (ISSI or drop-in parts from Winbond, Macronix, Cypress, etc.).