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HSMS-C170
LED RED DIFFUSED CHIP SMD
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規格
| Part Status | Active |
| Color | Red |
| Configuration | Standard |
| Lens Color | White |
| Lens Transparency | Diffused |
| Millicandela Rating | 10mcd |
| Lens Style | Rectangle with Flat Top |
| Lens Size | 1.40mm x 1.25mm |
| Voltage - Forward (Vf) (Typ) | 2.1V |
| Current - Test | 20mA |
| Viewing Angle | 170° |
| Mounting Type | Surface Mount |
| Wavelength - Dominant | 626nm |
| Wavelength - Peak | 630nm |
| Package / Case | 0805 (2012 Metric) |
| Supplier Device Package | Chip LED |
| Size / Dimension | 2.00mm L x 1.25mm W |
| Height (Max) | 0.80mm |
| Base Product Number | HSMS-C170 |
概述
Description
HSMS-C170 is a standard developed by the Semiconductor Equipment and Materials International (SEMI) organization, which focuses on the communication between semiconductor manufacturing equipment and host systems. It falls under the broader category of High-Speed Manufacturing Systems (HSMS) standards, which aim to enhance automation and data exchange in semiconductor manufacturing.
The HSMS-C170 standard specifically defines a protocol for data transfer and communication, facilitating interoperability between different equipment and systems. It supports real-time data exchange, which is critical for optimizing manufacturing processes, enhancing productivity, and ensuring quality control in semiconductor fabrication.
By adhering to HSMS-C170, manufacturers can streamline operations, reduce downtime, and improve overall efficiency in their production environments. This standard is part of a framework that promotes consistent and standardized communication protocols across the semiconductor industry, enabling better integration of equipment and systems across diverse manufacturing environments.
The HSMS-C170 standard specifically defines a protocol for data transfer and communication, facilitating interoperability between different equipment and systems. It supports real-time data exchange, which is critical for optimizing manufacturing processes, enhancing productivity, and ensuring quality control in semiconductor fabrication.
By adhering to HSMS-C170, manufacturers can streamline operations, reduce downtime, and improve overall efficiency in their production environments. This standard is part of a framework that promotes consistent and standardized communication protocols across the semiconductor industry, enabling better integration of equipment and systems across diverse manufacturing environments.
Features
The HSMS-C170 is a high-speed silicon photodiode designed for optical communications and various sensing applications. Key features include:
1. High Responsivity: Offers excellent sensitivity in the visible to near-infrared range, making it suitable for diverse optical signals.
2. Fast Response Time: Capable of capturing high-speed signals, ideal for data transmission up to several GHz.
3. Low Dark Current: Minimizes noise, enhancing signal integrity in low-light applications.
4. Wide Operating Range: Functions effectively over a broad range of wavelengths, typically from 400 nm to 1100 nm.
5. Compact Size: Designed for easy integration into various systems, including fiber optic networks and consumer electronics.
6. Temperature Stability: Maintains performance across a range of temperatures, ensuring reliable operation in varying conditions.
These features make the HSMS-C170 a versatile choice for optical applications, including telecommunications, medical devices, and industrial automation.
1. High Responsivity: Offers excellent sensitivity in the visible to near-infrared range, making it suitable for diverse optical signals.
2. Fast Response Time: Capable of capturing high-speed signals, ideal for data transmission up to several GHz.
3. Low Dark Current: Minimizes noise, enhancing signal integrity in low-light applications.
4. Wide Operating Range: Functions effectively over a broad range of wavelengths, typically from 400 nm to 1100 nm.
5. Compact Size: Designed for easy integration into various systems, including fiber optic networks and consumer electronics.
6. Temperature Stability: Maintains performance across a range of temperatures, ensuring reliable operation in varying conditions.
These features make the HSMS-C170 a versatile choice for optical applications, including telecommunications, medical devices, and industrial automation.
Package
The HSMS-C170 is a photodiode packaged in a standard TO-39 metal can. This package type provides excellent thermal stability and protection, making it suitable for various optical applications. Its compact design ensures ease of integration into electronic systems.
Pinout
The HSMS-C170 is a phototransistor manufactured by Avago Technologies (now part of Broadcom). It features a total of 3 pins. The pin configuration and their functions are as follows:
1. Collector (C): This pin is connected to the positive supply voltage in the circuit.
2. Emitter (E): This pin is connected to ground or the negative side of the circuit. The current flows from collector to emitter when the phototransistor is activated by light.
3. Base (B): This pin is used to control the sensitivity of the phototransistor, although it is often left open for typical applications.
The HSMS-C170 is commonly used in optical applications, such as in light detection and communication systems. Its characteristics include a fast response time and high sensitivity to infrared light.
1. Collector (C): This pin is connected to the positive supply voltage in the circuit.
2. Emitter (E): This pin is connected to ground or the negative side of the circuit. The current flows from collector to emitter when the phototransistor is activated by light.
3. Base (B): This pin is used to control the sensitivity of the phototransistor, although it is often left open for typical applications.
The HSMS-C170 is commonly used in optical applications, such as in light detection and communication systems. Its characteristics include a fast response time and high sensitivity to infrared light.
Manufacturer
The HSMS-C170 is manufactured by Broadcom Inc., a global technology company that specializes in designing and developing a wide range of semiconductor and infrastructure software solutions. Originally part of Avago Technologies, Broadcom has a diverse product portfolio that includes networking, broadband, enterprise storage, and wireless communication technologies. The company serves various sectors, including telecommunications, data centers, and consumer electronics. Broadcom is recognized for its innovation and plays a significant role in advancing connectivity and data processing technologies across multiple industries.
Application
The HSMS-C170 is primarily used in optical communication systems, particularly as a photodetector for high-speed data transmission. Its application areas include fiber optic networks, optical sensors, and laser-based communication systems. Additionally, it finds use in medical imaging, industrial automation, and research laboratories for detecting light signals and converting them into electrical signals.
Equivalent
Equivalent products to the HSMS-C170 chip include the HSMS-C180, HSMS-C190, and other similar silicon photodiodes from manufacturers like Broadcom, Vishay, and Osram. Check specific datasheets for electrical characteristics and performance to ensure compatibility.
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