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H57V2562GTR-75C

Name: H57V2562GTR-75C
Rating: 4.7 (12 reviews)

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規格

Manufacturer	SK HYNIX
Package	TSOP-54-10.2mm

概述

Description

The H57V2562GTR-75C is a type of DRAM (Dynamic Random Access Memory) chip, specifically designed for memory applications. Manufactured by Hynix Semiconductor (now SK Hynix), this chip features a 256Mb (megabit) capacity and operates with a 75ns (nanosecond) access time. It is commonly used in various electronic devices, including computers, smartphones, and embedded systems, to provide fast data storage and retrieval.
This DRAM operates on a 3.3V power supply and typically comes in a configuration suitable for a variety of memory applications, including SDRAM (Synchronous DRAM). The "GTR" suffix indicates the package type and pin configuration, while the "C" may refer to specific process technology or version.
Overall, the H57V2562GTR-75C is notable for its speed and efficiency, making it suitable for performance-critical applications.

Features

The H57V2562GTR-75C is a 256Mb (32MB) DDR2 SDRAM memory chip, commonly used in various electronic devices. Its key features include:
1. Density: 256 Megabits, organized as x16 bits, making it suitable for various applications needing moderate memory capacity.
2. Speed: Operates at a clock frequency of 400 MHz, supporting data rates up to 800 Mbps.
3. Voltage: Typically operates at 1.8V, which helps reduce power consumption compared to older DDR technologies.
4. Package Type: Available in a TSOP II (Thin Small Outline Package) for compact integration on PCBs.
5. Features: Supports synchronous data transfer, burst read/write operations, and has a configurable burst length of 4 or 8 bits.
6. Applications: Commonly used in mobile devices, laptops, and mid-range computing systems.
This chip provides a balance of performance and efficiency, making it a versatile choice for various applications in the consumer electronics market.

Package

The H57V2562GTR-75C is a DRAM chip packaged in a TSOP (Thin Small Outline Package) type. This packaging is designed for high-density memory applications, providing a compact footprint for efficient space utilization on circuit boards.

Pinout

The H57V2562GTR-75C is a 256Mbit (32M x 8) DDR2 SDRAM memory chip. It features a 54-pin TSOP II package. The pin functions include power supply pins (VDD, VSS), data input/output pins (DQ0-DQ7), address pins (A0-A11), control pins (CS, RAS, CAS, WE), and clock pins (CK, CK#).
This memory chip operates at a clock frequency of 400 MHz and is designed for high-speed applications, making it suitable for use in various electronic devices. The specific functions of each pin are essential for ensuring proper communication and data transfer between the memory and the memory controller.

Manufacturer

The H57V2562GTR-75C is manufactured by Hynix Semiconductor Inc., a South Korean company. Hynix, now known as SK Hynix, is one of the world's largest manufacturers of semiconductor products, specializing in memory chips such as DRAM and NAND flash memory. The company was founded in 1983 and has since become a significant player in the global semiconductor market, supplying products for various applications, including smartphones, computers, and other electronic devices. SK Hynix is recognized for its innovation and development of cutting-edge memory technologies, contributing significantly to advancements in the electronics industry.

Application

The H57V2562GTR-75C is a 256 Mb (megabit) DRAM memory chip commonly used in applications such as consumer electronics, mobile devices, industrial equipment, networking, and automotive systems. Its characteristics make it suitable for high-speed data processing and storage in devices requiring efficient memory solutions.

Equivalent

The H57V2562GTR-75C is a 256Mb DDR SDRAM chip. Equivalent products include:
1. MT48LC16M16A2P-75
2. K4S561632B-75
3. IS43TR16640B-75B
Ensure to verify specifications like voltage, speed, and package type for compatibility.