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H26M64208EMR
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規格
| Manufacturer | SK HYNIX |
| Package | FBGA-153_11.5X13.0mm |
概述
Description
H26M64208EMR is a 4 Megabit (512K x 8) dynamic random-access memory (DRAM) chip designed for various electronic applications. It typically operates using a 3.3V power supply and features a fast access time, making it suitable for high-speed data processing. The chip is constructed using advanced fabrication technologies to enhance performance and minimize power consumption.
Key characteristics include a synchronous operation, which allows it to synchronize with a clock signal for improved data transfer rates. The device is often utilized in consumer electronics, telecommunications, and computing systems where efficient memory solutions are needed.
The H26M64208EMR is favored for its reliability and capacity to support multiple data processing tasks simultaneously, contributing to overall system performance. It is compatible with various industry-standard interfaces, facilitating integration into diverse electronic designs.
Key characteristics include a synchronous operation, which allows it to synchronize with a clock signal for improved data transfer rates. The device is often utilized in consumer electronics, telecommunications, and computing systems where efficient memory solutions are needed.
The H26M64208EMR is favored for its reliability and capacity to support multiple data processing tasks simultaneously, contributing to overall system performance. It is compatible with various industry-standard interfaces, facilitating integration into diverse electronic designs.
Features
The H26M64208EMR is a 512Mb (megabit) NAND Flash memory chip designed for various applications, including consumer electronics and industrial devices. Key features include:
1. Density: 512Mb capacity, suitable for data storage needs.
2. Interface: It typically operates through a parallel interface, facilitating easy integration into various systems.
3. Page Size: Standard page size of 2KB, allowing efficient data management and retrieval.
4. Block Structure: Organized in blocks, enabling efficient erasing and rewriting processes.
5. High Performance: Offers fast read and write speeds, enhancing overall system performance.
6. Endurance: Designed for a high number of program/erase cycles, ensuring longevity.
7. Low Power Consumption: Suitable for battery-operated devices, minimizing energy usage.
8. Temperature Range: Operates effectively across a wide temperature range, ensuring reliability in diverse environments.
These features make the H26M64208EMR suitable for a variety of applications where reliable, high-capacity storage is required.
1. Density: 512Mb capacity, suitable for data storage needs.
2. Interface: It typically operates through a parallel interface, facilitating easy integration into various systems.
3. Page Size: Standard page size of 2KB, allowing efficient data management and retrieval.
4. Block Structure: Organized in blocks, enabling efficient erasing and rewriting processes.
5. High Performance: Offers fast read and write speeds, enhancing overall system performance.
6. Endurance: Designed for a high number of program/erase cycles, ensuring longevity.
7. Low Power Consumption: Suitable for battery-operated devices, minimizing energy usage.
8. Temperature Range: Operates effectively across a wide temperature range, ensuring reliability in diverse environments.
These features make the H26M64208EMR suitable for a variety of applications where reliable, high-capacity storage is required.
Package
The H26M64208EMR is packaged in a TSOP (Thin Small Outline Package) type, specifically designed for memory devices. This package type is characterized by its flat, low-profile design and is commonly used for high-density memory chips in various electronic applications.
Pinout
The H26M64208EMR is a 4M x 16-bit NAND flash memory device with a total of 48 pins. It is designed for use in various applications, including mobile devices and consumer electronics.
Pin Functions:
- Data I/O Pins (DQ0-DQ15): Used for data input and output.
- Address Pins (A0-A19): Used to select memory locations.
- Control Pins:
- CE (Chip Enable): Activates the device.
- WE (Write Enable): Initiates a write operation.
- RE (Read Enable): Initiates a read operation.
- ALE (Address Latch Enable): Latches the address.
- CLE (Command Latch Enable): Latches commands.
- WP (Write Protect): Provides write protection.
- R/B (Ready/Busy): Indicates the status of device operations.
- VCC and VSS: Supply and ground pins.
The device supports various operations such as read, program, and erase, allowing efficient data storage and retrieval.
Pin Functions:
- Data I/O Pins (DQ0-DQ15): Used for data input and output.
- Address Pins (A0-A19): Used to select memory locations.
- Control Pins:
- CE (Chip Enable): Activates the device.
- WE (Write Enable): Initiates a write operation.
- RE (Read Enable): Initiates a read operation.
- ALE (Address Latch Enable): Latches the address.
- CLE (Command Latch Enable): Latches commands.
- WP (Write Protect): Provides write protection.
- R/B (Ready/Busy): Indicates the status of device operations.
- VCC and VSS: Supply and ground pins.
The device supports various operations such as read, program, and erase, allowing efficient data storage and retrieval.
Manufacturer
The H26M64208EMR is manufactured by Hynix Semiconductor, which is now known as SK Hynix Inc. SK Hynix is a South Korean company that specializes in the production of semiconductor products, particularly DRAM and NAND flash memory. Founded in 1983, it has become one of the largest memory chip manufacturers in the world. The company serves various sectors, including consumer electronics, mobile devices, and data centers, providing essential memory solutions for a wide range of applications. SK Hynix is known for its commitment to innovation and research in the semiconductor field.
Application
The H26M64208EMR is a 64Mb NAND flash memory device, commonly used in applications such as mobile devices, digital cameras, portable media players, and embedded systems. It is suitable for data storage in smartphones, tablets, and high-capacity memory cards. Additionally, it can be utilized in automotive, industrial, and consumer electronics for firmware storage, file systems, and data logging, providing reliable and high-speed performance in various environments.
Equivalent
The H26M64208EMR chip is a 64Mb NOR Flash memory. Equivalent products include the Spansion S29GL064N, Micron M25P64, and Winbond W25Q64. These alternatives also offer similar memory capacity and interface compatibility.
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