圖片僅供參考
H26M64103EMR
- 製造商
- 製造商。 部分 #H26M64103EMR
- 包
- 資料表
- 有現貨的28878
100%原創; 新
24小時準備發貨
365天保修
RFQ&; 獲得更多折扣
規格
| Manufacturer | JLCPCB Assembly |
| Package | FBGA-153_L13.0-W11.5 |
概述
Description
H26M64103EMR is a type of DRAM (Dynamic Random Access Memory) chip, specifically designed for high-density memory applications. It typically features a 64Mb capacity and is organized in a 4M x 16 configuration, facilitating efficient data storage and retrieval. This memory chip is often used in telecommunications, consumer electronics, and computing devices where reliable and fast memory access is crucial.
Key specifications may include operating voltage, access time, and refresh rates, which are important for performance and power efficiency. The chip is generally manufactured using advanced semiconductor technologies, ensuring high speed and low power consumption.
H26M64103EMR is notable for its compatibility with various memory standards, making it suitable for integration in diverse electronic systems. It is essential for developers and engineers to refer to the chip's datasheet for detailed information on pin configurations, electrical characteristics, and application guidelines.
Key specifications may include operating voltage, access time, and refresh rates, which are important for performance and power efficiency. The chip is generally manufactured using advanced semiconductor technologies, ensuring high speed and low power consumption.
H26M64103EMR is notable for its compatibility with various memory standards, making it suitable for integration in diverse electronic systems. It is essential for developers and engineers to refer to the chip's datasheet for detailed information on pin configurations, electrical characteristics, and application guidelines.
Features
The H26M64103EMR is a 4 Megabit (512 K x 8) flash memory device designed for various embedded applications. It features a compact design, supporting a wide voltage range (typically 2.7V to 3.6V), which allows for versatile usage in different electrical environments. Key features include:
- Access Speed: Offers fast read access times, typically around 70 ns.
- Data Retention: Ensures data retention for up to 20 years, making it reliable for long-term storage.
- Erase/Program Cycles: Supports a minimum of 10,000 erase/program cycles, suitable for frequent updates.
- Interface: Utilizes a standard parallel interface for easy integration into existing systems.
- Power Efficiency: Low power consumption in active and standby modes enhances battery life in portable applications.
- Temperature Range: Designed to operate in a wide temperature range, ensuring stability in diverse environments.
The H26M64103EMR is ideal for applications such as consumer electronics, automotive systems, and industrial devices, providing a balance of performance, reliability, and efficiency.
- Access Speed: Offers fast read access times, typically around 70 ns.
- Data Retention: Ensures data retention for up to 20 years, making it reliable for long-term storage.
- Erase/Program Cycles: Supports a minimum of 10,000 erase/program cycles, suitable for frequent updates.
- Interface: Utilizes a standard parallel interface for easy integration into existing systems.
- Power Efficiency: Low power consumption in active and standby modes enhances battery life in portable applications.
- Temperature Range: Designed to operate in a wide temperature range, ensuring stability in diverse environments.
The H26M64103EMR is ideal for applications such as consumer electronics, automotive systems, and industrial devices, providing a balance of performance, reliability, and efficiency.
Package
The H26M64103EMR is typically available in a TSOP (Thin Small Outline Package) type. This package design allows for a compact footprint suitable for various electronic applications, optimizing space on printed circuit boards.
Pinout
The H26M64103EMR is a 64Mbit NAND Flash memory chip. It features a pin count of 48 pins. The primary functions of these pins include data input/output, control signals, power supply, and ground connections.
Key pin functions include:
- D0-D7: Data input/output lines used for transferring data.
- CLE (Command Latch Enable): Used to latch command inputs.
- ALE (Address Latch Enable): Used to latch address inputs.
- WE (Write Enable): Enables write operations.
- RE (Read Enable): Enables read operations.
- CE (Chip Enable): Activates the chip for read/write operations.
- WP (Write Protect): Provides write protection when high.
- RB (Ready/Busy): Indicates the status of the device.
This chip is often used in consumer electronics, mobile devices, and other applications requiring compact and efficient non-volatile storage.
Key pin functions include:
- D0-D7: Data input/output lines used for transferring data.
- CLE (Command Latch Enable): Used to latch command inputs.
- ALE (Address Latch Enable): Used to latch address inputs.
- WE (Write Enable): Enables write operations.
- RE (Read Enable): Enables read operations.
- CE (Chip Enable): Activates the chip for read/write operations.
- WP (Write Protect): Provides write protection when high.
- RB (Ready/Busy): Indicates the status of the device.
This chip is often used in consumer electronics, mobile devices, and other applications requiring compact and efficient non-volatile storage.
Manufacturer
The H26M64103EMR is manufactured by Hynix Semiconductor, which is now known as SK Hynix Inc. SK Hynix is a South Korean multinational company that specializes in semiconductor manufacturing. It is one of the largest memory chip producers in the world, focusing on dynamic random-access memory (DRAM) and NAND flash memory products. Founded in 1983, the company has grown to be a significant player in the global semiconductor market, supplying memory solutions for various applications, including computers, smartphones, and servers. SK Hynix is known for its innovation and investment in research and development to advance memory technologies.
Application
The H26M64103EMR is a 64Mb (8MB) NOR Flash memory chip commonly used in embedded systems for applications such as consumer electronics, automotive, telecommunications, and industrial devices. It is suitable for code storage, firmware updates, and data retention due to its reliable performance and fast read speeds. Typical use cases include smartphones, tablets, digital cameras, and IoT devices where non-volatile memory is essential for storing critical data and software.
Equivalent
The H26M64103EMR chip, a 64Mbit DRAM, is equivalent to several other products including:
- Hynix HY57V641620
- Samsung K4S641632E
- Micron MT48LC4M16A2
- Winbond W9425G6JH
Always verify specifications and compatibility based on your specific application requirements.
- Hynix HY57V641620
- Samsung K4S641632E
- Micron MT48LC4M16A2
- Winbond W9425G6JH
Always verify specifications and compatibility based on your specific application requirements.
船舶
運輸管道我們
通過DHL、FedEx、TNT、UPS或您選擇的任何其他貨運代理提供全球運輸服務。
運費參攷(DHL/FedEx):
動態主要裝載: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為2-5個工作日。
聯邦快遞: 運費從25美元到40美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
不斷電供應系統: 運費從25美元到45美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
三硝基甲苯: 運費從25美元到65美元(0.5公斤)不等,預計交貨時間為3-7個工作日。
增强型短消息: 運費從30美元到50美元(0.5公斤)不等,預計交貨時間為7-15個工作日。
掛號: 運費為2-4美元(0.1公斤),預計交貨時間為5-20個工作日。
支付
Payment Methods
付款條件為100%預付。
現時,我們只接受以下付款方式:
1. 貝寶
2. 信用卡/借記卡
3. 電匯
類似的
-
MX25L3233FM1I-08Q
Macronix
-
MX25V1635FZNQ03
Macronix
-
MX25V4035FZUI
Macronix
-
MX25L8035EM2I-10G
Macronix
-
MX25R6435FBDIL0
Macronix
-
MX25R1635FZUIH0
Macronix
-
MX25L6433FM2I-08G
Macronix
-
MX25L12833FZNI-10..
Macronix
-
MX25U25645GXDI00
Macronix
-
MX25L25645GXDI-08..
Macronix
-
MX29LV640ETTI-70G
Macronix
-
MX66U1G45GMI00
Macronix