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H26M41204HPR
8GB FBGA-153 Specialized Memory Products RoHS
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規格
| Packaging | FBGA-153 |
| Memory Size | 8GB |
| Operating Temperature | -25℃~+85℃ |
概述
Description
H26M41204HPR is a type of NAND flash memory chip manufactured by Samsung. It typically features a 4GB capacity, which is part of the MLC (Multi-Level Cell) category, allowing it to store multiple bits of data per cell, resulting in higher storage density. This chip is often used in smartphones, tablets, and other portable devices due to its speed and reliability. The "HPR" designation suggests that it may have specific performance enhancements or features that optimize its operation in various applications. Additionally, it complies with industry standards for data integrity and endurance, making it suitable for both consumer and industrial use. The H26M41204HPR plays a crucial role in the storage hierarchy by providing fast access to data while maintaining a compact form factor.
Package
The H26M41204HPR is a NAND flash memory chip packaged in a TSOP (Thin Small Outline Package) format.
Pinout
The H26M41204HPR is a 4 Megabit (512K x 8) NAND flash memory chip. It typically features a 8-pin configuration. The primary functions of the pins are as follows:
1. Chip Enable (CE): Activates the chip for read or write operations.
2. Write Enable (WE): Controls write operations to the memory.
3. Output Enable (OE): Enables output data from the memory.
4. Data Input/Output (D0-D7): These are the 8 data lines used for data transfer.
5. Address Lines (A0-A18): Used for addressing the memory locations (though not specifically listed in the pin count, these are critical for accessing different memory locations).
6. Vcc: Power supply pin.
7. GND: Ground pin.
Always refer to the specific datasheet for detailed pinout and operational information, as configurations may vary slightly between different manufacturers or models.
1. Chip Enable (CE): Activates the chip for read or write operations.
2. Write Enable (WE): Controls write operations to the memory.
3. Output Enable (OE): Enables output data from the memory.
4. Data Input/Output (D0-D7): These are the 8 data lines used for data transfer.
5. Address Lines (A0-A18): Used for addressing the memory locations (though not specifically listed in the pin count, these are critical for accessing different memory locations).
6. Vcc: Power supply pin.
7. GND: Ground pin.
Always refer to the specific datasheet for detailed pinout and operational information, as configurations may vary slightly between different manufacturers or models.
Manufacturer
The H26M41204HPR is manufactured by Hynix Semiconductor, which is now known as SK Hynix Inc. SK Hynix is a South Korean company that specializes in the production of memory semiconductors, including DRAM (Dynamic Random Access Memory) and NAND flash memory. They are one of the largest semiconductor manufacturers globally and are a key player in the memory market, supplying products for various applications including computers, smartphones, and other electronic devices. The company is part of the SK Group, a major South Korean conglomerate, and is known for its focus on innovation and technology in the semiconductor industry.
Application
The H26M41204HPR is a NAND flash memory chip primarily used in applications such as consumer electronics, mobile devices, and embedded systems. It is suitable for data storage in smartphones, tablets, and digital cameras, as well as in automotive applications and industrial equipment for data logging and firmware storage. Its high density and performance make it ideal for applications requiring reliable flash memory solutions.
Equivalent
The H26M41204HPR chip is a 4M x 4-bit NAND Flash memory. Equivalent products include:
1. H26M41204FPR
2. H26M41204LPR
3. H26M41204GPR
These alternatives may vary in configurations, speed, or packaging, so it’s important to verify compatibility based on specific requirements. Always check datasheets for detailed specifications.
1. H26M41204FPR
2. H26M41204LPR
3. H26M41204GPR
These alternatives may vary in configurations, speed, or packaging, so it’s important to verify compatibility based on specific requirements. Always check datasheets for detailed specifications.
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