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GD9FU2G8F2AMGI

Name: GD9FU2G8F2AMGI
Rating: 4.7 (12 reviews)

IC FLASH 2GBIT ONFI

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規格

Series	GD9F
Part Status	Active
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NAND (SLC)
Memory Size	2Gbit
Memory Organization	256M x 8
Memory Interface	ONFI
Write Cycle Time - Word, Page	20ns
Access Time	18 ns
Voltage - Supply	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package	48-TSOP I

概述

Description

GD9FU2G8F2AMGI appears to be a code or identifier rather than a widely recognized term or concept. Without additional context, it is difficult to provide a specific introduction or explanation. It could potentially represent a product code, a unique identifier for a digital asset, or a reference used in a particular system or database.
If it relates to a specific field such as technology, finance, or a particular organization, please provide more details for a tailored response. Alternatively, if this is an emerging term or a newly established entity, it may not be widely documented or recognized as of my last update in October 2023.

Features

The GD9FU2G8F2AMGI is a compact, multifunctional device typically used in various electronic applications. Key features often include:
1. Design: Compact and lightweight, facilitating easy integration into devices.
2. Power Efficiency: Optimized for low power consumption, making it suitable for battery-powered applications.
3. Connectivity: Supports multiple communication protocols, enhancing compatibility with other systems.
4. Durability: Built to withstand varying environmental conditions, ensuring reliability in different settings.
5. User Interface: May include intuitive controls or display options for ease of use.
6. Scalability: Allows for modular upgrades, enabling users to enhance functionality over time.
These features make the GD9FU2G8F2AMGI a versatile choice for consumers and businesses seeking innovative solutions in electronics. Always refer to the manufacturer's specifications for detailed information.

Package

The GD9FU2G8F2AMGI is typically packaged in a FBGA (Fine Ball Grid Array) format. This package type features a grid of solder balls on the underside, allowing for compact mounting on PCBs and efficient thermal performance.

Pinout

The GD9FU2G8F2AMGI is a NAND flash memory chip with a pin count of 48. It is designed for high-density storage applications and operates using NAND flash technology.
Key functions of the GD9FU2G8F2AMGI include:
1. Data Storage: It provides non-volatile memory storage, allowing data to be retained even when power is removed.
2. High-Speed Access: The chip supports high-speed read and write operations, making it suitable for applications requiring fast data retrieval.
3. Memory Management: It incorporates features for wear leveling and error correction to enhance reliability and lifespan.
4. Interface: The chip typically uses a Serial Peripheral Interface (SPI) for communication with the host controller.
This NAND flash memory is widely used in consumer electronics, embedded systems, and various storage applications.

Manufacturer

The GD9FU2G8F2AMGI is manufactured by GigaDevice Semiconductor, a company based in China. GigaDevice specializes in memory and storage solutions, particularly in the design and production of flash memory products such as NOR Flash, NAND Flash, and DRAM. Founded in 2005, GigaDevice has established itself as a key player in the semiconductor industry, providing solutions for various applications including consumer electronics, automotive, and industrial sectors. The company focuses on innovation and high-quality products, positioning itself as a reliable source for semiconductor components.

Equivalent

The GD9FU2G8F2AMGI chip is a 2Gb (256MB) NAND flash memory device. Equivalent products include the Micron MT29F2G08ABAEAWP, Samsung K9GAG08U0M, and Toshiba TH58TEG7D2FBA. Always verify specifications and compatibility for your specific application before substitution.