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GD9FU1G8F2AMGI
IC FLASH 1GBIT 48TSOP I
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規格
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 1Gbit |
| Memory Organization | 128M x 8 |
| Voltage - Supply | 2.7V ~ 3.6V |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.173", 4.40mm Width) |
| Supplier Device Package | 48-TSOP I |
| Base Product Number | GD9FU1G8 |
概述
Description
GD9FU1G8F2AMGI appears to be a code or identifier, but without additional context, its specific meaning is unclear. It could pertain to a variety of fields such as technology, product identification, or software versions. To provide an accurate introduction, more information about the context in which this identifier is used is needed. If it relates to a product, project, or system, details such as its purpose, features, and applications would be essential. Please provide further context or specify the domain in which this code is relevant for a more precise introduction.
Package
The GD9FU1G8F2AMGI is typically packaged in a thin QFN (Quad Flat No-lead) format. This package type is designed for compactness and efficient thermal performance, making it suitable for various electronic applications.
Pinout
The GD9FU1G8F2AMGI is a 1Gbit (128MB) NAND Flash memory chip. It typically features 8 pins, which serve the following functions:
1. VCC: Power supply for the chip.
2. GND: Ground connection.
3. CE: Chip Enable, used for selecting the chip.
4. RE: Read Enable, controls read operations.
5. WE: Write Enable, controls write operations.
6. A0-A6: Address inputs (A0 to A6) used for addressing memory locations.
7. DQ0-DQ7: Data Inputs/Outputs, used for data transfer in and out of the chip.
The NAND Flash is typically used in various applications, including mobile devices, consumer electronics, and embedded systems for data storage. Always refer to the specific datasheet for detailed electrical characteristics and pin configurations.
1. VCC: Power supply for the chip.
2. GND: Ground connection.
3. CE: Chip Enable, used for selecting the chip.
4. RE: Read Enable, controls read operations.
5. WE: Write Enable, controls write operations.
6. A0-A6: Address inputs (A0 to A6) used for addressing memory locations.
7. DQ0-DQ7: Data Inputs/Outputs, used for data transfer in and out of the chip.
The NAND Flash is typically used in various applications, including mobile devices, consumer electronics, and embedded systems for data storage. Always refer to the specific datasheet for detailed electrical characteristics and pin configurations.
Manufacturer
The GD9FU1G8F2AMGI is manufactured by GigaDevice Semiconductor Inc. GigaDevice is a semiconductor company based in China, primarily known for its non-volatile memory products, including Flash memory and microcontrollers. Founded in 2005, GigaDevice specializes in the design and development of memory solutions, serving various applications such as consumer electronics, automotive, and industrial sectors. The company aims to provide innovative solutions in the semiconductor field, focusing on high-performance and reliable memory products.
Equivalent
The GD9FU1G8F2AMGI chip is a 1Gbit (128MB) NAND Flash memory device. Equivalent products include:
1. Micron MT29F1G08ABAEAWP - 1Gbit NAND Flash.
2. Samsung K9GAG08U0M - 1Gbit NAND Flash.
3. Toshiba TH58NVG1S3HBA - 1Gbit NAND Flash.
Always verify compatibility based on specific application requirements.
1. Micron MT29F1G08ABAEAWP - 1Gbit NAND Flash.
2. Samsung K9GAG08U0M - 1Gbit NAND Flash.
3. Toshiba TH58NVG1S3HBA - 1Gbit NAND Flash.
Always verify compatibility based on specific application requirements.
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