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ESP32-PICO-V3-02
SIP MODULE WIFI BLE COMBO
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- 資料表 ESP32-PICO-V3-02 DataSheet
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規格
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | ESP32 |
| ProductStatus | Active |
| RFFamily/Standard | Bluetooth, WiFi |
| Protocol | 802.11b/g/n, Bluetooth v4.2 |
| Frequency | 2.4GHz |
| DataRate | 150Mbps |
| Power-Output | 19.5dBm |
| Sensitivity | -97dBm |
| SerialInterfaces | ADC, GPIO, I²C, I²S, SDIO, SPI, PWM, UART |
| AntennaType | Antenna Not Included, I-PEX |
| UtilizedIC/Part | ESP32 |
| MemorySize | 8MB Flash, 2MB SRAM |
| Voltage-Supply | 3V ~ 3.6V |
| Current-Receiving | 111mA ~ 117mA |
| Current-Transmitting | 205mA ~ 385mA |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 85°C |
概述
Description
The ESP32-PICO-V3-02 is a compact, highly integrated module that is part of Espressif Systems' ESP32 family. It is designed for use in IoT applications and offers a robust solution for wireless connectivity with both Wi-Fi and Bluetooth capabilities. The module combines a dual-core Xtensa® 32-bit LX6 microprocessor with integrated RF components, including a 4 MB flash memory, enabling efficient performance and reduced development complexity.
Key features include:
1. Dual-Core Processor: Offers high processing power with low energy consumption, suitable for multitasking in complex IoT applications.
2. Connectivity: Supports Wi-Fi (802.11 b/g/n) and Bluetooth (v4.2 BR/EDR and BLE) for robust wireless communication options.
3. Integration: The module integrates essential components like crystal oscillators, RF matching links, and filters, reducing the need for external circuitry.
4. Compact Design: Its small footprint makes it ideal for space-constrained applications.
5. Security: Features hardware encryption, secure boot, and flash encryption to protect against unauthorized access.
Overall, the ESP32-PICO-V3-02 is designed for ease of use, reliability, and performance, making it a popular choice for developers needing a versatile solution for wireless IoT projects.
Key features include:
1. Dual-Core Processor: Offers high processing power with low energy consumption, suitable for multitasking in complex IoT applications.
2. Connectivity: Supports Wi-Fi (802.11 b/g/n) and Bluetooth (v4.2 BR/EDR and BLE) for robust wireless communication options.
3. Integration: The module integrates essential components like crystal oscillators, RF matching links, and filters, reducing the need for external circuitry.
4. Compact Design: Its small footprint makes it ideal for space-constrained applications.
5. Security: Features hardware encryption, secure boot, and flash encryption to protect against unauthorized access.
Overall, the ESP32-PICO-V3-02 is designed for ease of use, reliability, and performance, making it a popular choice for developers needing a versatile solution for wireless IoT projects.
Features
The ESP32-PICO-V3-02 is a compact, high-performance microcontroller module designed by Espressif Systems. It integrates the ESP32 SoC, known for its dual-core (Xtensa® 32-bit LX6) capabilities, with 2.4 GHz Wi-Fi and Bluetooth 4.2 connectivity. The module offers 8 MB of embedded flash memory, making it suitable for complex applications requiring substantial storage.
Key features include:
- Dual-core processor with adjustable clock frequency of up to 240 MHz.
- Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth v4.2 BR/EDR and BLE.
- Low power consumption with multiple power modes, allowing for efficient battery use.
- Rich interfaces for peripherals, including 34 programmable GPIOs, SPI, I2C, UART, I2S, and PWM.
- Secure boot and Flash encryption for enhanced security.
- Built-in Hall Sensor and Temperature Sensor for additional sensing capabilities.
- Small form factor (7.0 mm x 7.0 mm x 0.94 mm) suitable for space-constrained applications.
- Operates at a wide temperature range from -40°C to +85°C, making it versatile for various environments.
The ESP32-PICO-V3-02 is ideal for IoT applications, smart devices, and wearable electronics requiring robust connectivity and low energy consumption.
Key features include:
- Dual-core processor with adjustable clock frequency of up to 240 MHz.
- Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth v4.2 BR/EDR and BLE.
- Low power consumption with multiple power modes, allowing for efficient battery use.
- Rich interfaces for peripherals, including 34 programmable GPIOs, SPI, I2C, UART, I2S, and PWM.
- Secure boot and Flash encryption for enhanced security.
- Built-in Hall Sensor and Temperature Sensor for additional sensing capabilities.
- Small form factor (7.0 mm x 7.0 mm x 0.94 mm) suitable for space-constrained applications.
- Operates at a wide temperature range from -40°C to +85°C, making it versatile for various environments.
The ESP32-PICO-V3-02 is ideal for IoT applications, smart devices, and wearable electronics requiring robust connectivity and low energy consumption.
Package
The ESP32-PICO-V3-02 is encapsulated in a QFN package. This package integrates a crystal oscillator, flash memory, filters, and RF matching components, offering a compact and fully integrated solution for IoT applications.
Pinout
The ESP32-PICO-V3-02 is a System-in-Package (SiP) module that includes an ESP32 SoC. It features 48 pins in total. This module integrates a crystal oscillator, flash memory, filter capacitors, and RF matching links in a single package, making it suitable for compact applications.
Here are some key pin functions:
1. Power: Includes pins for power supply and ground.
2. GPIO: Multiple general-purpose input/output pins.
3. Analog: ADC pins for analog-to-digital conversion.
4. UART: Pins for serial communication (TX/RX).
5. SPI: Pins for Serial Peripheral Interface communication.
6. I2C: Pins for two-wire interfacing.
7. PWM: Pulse Width Modulation pins.
8. DAC: Digital-to-Analog Converter pins.
9. Other Interfaces: Includes I2S, touch sensor, and more.
The chip is designed for versatility, supporting Wi-Fi and Bluetooth connectivity, making it suitable for a wide range of IoT applications.
Here are some key pin functions:
1. Power: Includes pins for power supply and ground.
2. GPIO: Multiple general-purpose input/output pins.
3. Analog: ADC pins for analog-to-digital conversion.
4. UART: Pins for serial communication (TX/RX).
5. SPI: Pins for Serial Peripheral Interface communication.
6. I2C: Pins for two-wire interfacing.
7. PWM: Pulse Width Modulation pins.
8. DAC: Digital-to-Analog Converter pins.
9. Other Interfaces: Includes I2S, touch sensor, and more.
The chip is designed for versatility, supporting Wi-Fi and Bluetooth connectivity, making it suitable for a wide range of IoT applications.
Manufacturer
The ESP32-PICO-V3-02 is manufactured by Espressif Systems. Espressif Systems is a semiconductor company known for designing and producing wireless communication chips and modules. Founded in 2008 and headquartered in Shanghai, China, Espressif specializes in Wi-Fi, Bluetooth, and IoT solutions. The company is renowned for its ESP8266 and ESP32 series, which are highly popular in the maker and developer communities for creating Internet of Things (IoT) applications. Espressif Systems focuses on delivering integrated, low-power, and cost-effective solutions, making their products attractive for a wide range of applications, from consumer electronics to industrial automation.
Application
The ESP32-PICO-V3-02 is widely used in IoT applications due to its compact size and wireless capabilities. Key application areas include smart home devices, wearables, industrial automation, and consumer electronics. It supports functions like sensor data collection, remote control, voice recognition, and Bluetooth or Wi-Fi connectivity. Its integration capabilities make it ideal for developing applications that require efficient power management and real-time data processing.
Equivalent
The ESP32-PICO-V3-02 is a compact System-in-Package (SiP) module by Espressif. Equivalent products might include other small form-factor, Wi-Fi and Bluetooth-enabled microcontroller modules such as the ESP32-WROOM-32, ESP32-WROVER, and the nRF52840 by Nordic Semiconductor. These alternatives provide similar wireless connectivity and processing capabilities suitable for IoT applications. When selecting an equivalent, consider factors like form factor, power requirements, and specific application needs.
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