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EP3SL200F1152C4G
IC FPGA 744 I/O 1152FBGA
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規格
| Supplier | Intel |
| Package | Tray |
| ProductStatus | Active |
概述
Description
EP3SL200F1152C4G is an Altera/Intel Cyclone III FPGA. It targets low-cost, low-power applications and offers about 200k logic elements, embedded memory blocks, DSP/multiplier resources, and multiple I/O banks. The device comes in a 1152-pin BGA package (C4G) with speed grade F. It’s programmed with Intel’s Quartus Prime (formerly Quartus II) software and supports standard IP cores and clock-management features. Typical uses include cost-sensitive embedded, consumer, automotive, and industrial designs where moderate density and I/O are needed. When selecting, consider density, I/O requirements, memory needs, power budget, and package/pin constraints.
Features
Here are the key features of EP3SL200F1152C4G (Cyclone III SL FPGA):
- Family/device: EP3SL200 (Cyclone III SE), low-power FPGA
- Package: 1152-pin BGA (F1152)
- Logic density: ~200K logic elements (LEs)
- On-chip RAM: M9K blocks (9 Kb each) for embedded memory
- DSP: dedicated DSP blocks for MAC/multiply-accumulate
- Clocking: multiple PLLs for flexible clock management and global clock networks
- I/O: multiple banks with 3.3V I/O and support for common standards (LVTTL/LVCMOS, SSTL, HSTL, etc.)
- Core voltage: typically 1.2V core with 3.3V I/O rails
- Configuration: supports standard Altera/Intel configurations (JTAG, AS/Passive Serial, etc.)
- Temperature range: industrial (-40°C to 85°C)
- Development: supported by Quartus II software and Intel tooling
Note: exact RAM, DSP capacity, and I/O counts depend on configuration; refer to the datasheet for precise specifications.
- Family/device: EP3SL200 (Cyclone III SE), low-power FPGA
- Package: 1152-pin BGA (F1152)
- Logic density: ~200K logic elements (LEs)
- On-chip RAM: M9K blocks (9 Kb each) for embedded memory
- DSP: dedicated DSP blocks for MAC/multiply-accumulate
- Clocking: multiple PLLs for flexible clock management and global clock networks
- I/O: multiple banks with 3.3V I/O and support for common standards (LVTTL/LVCMOS, SSTL, HSTL, etc.)
- Core voltage: typically 1.2V core with 3.3V I/O rails
- Configuration: supports standard Altera/Intel configurations (JTAG, AS/Passive Serial, etc.)
- Temperature range: industrial (-40°C to 85°C)
- Development: supported by Quartus II software and Intel tooling
Note: exact RAM, DSP capacity, and I/O counts depend on configuration; refer to the datasheet for precise specifications.
Package
FBGA — FineLine Ball Grid Array. The EP3SL200F1152C4G uses a 1152-ball FBGA package (RoHS-compliant, as indicated by the C4G suffix).
Pinout
- Pin count: 1152 pins (BGA1152).
- Function: Altera/Intel Cyclone III FPGA (EP3SL200) in a 1152‑pin package; a 200K logic-element FPGA with configurable IO banks, DSP blocks, and PLLs for general-purpose digital logic.
- Function: Altera/Intel Cyclone III FPGA (EP3SL200) in a 1152‑pin package; a 200K logic-element FPGA with configurable IO banks, DSP blocks, and PLLs for general-purpose digital logic.
Manufacturer
- Manufacturer: Xilinx, Inc.
- What kind of company: A global semiconductor company that designs and sells programmable logic devices (FPGAs and CPLDs) and related software.
- What kind of company: A global semiconductor company that designs and sells programmable logic devices (FPGAs and CPLDs) and related software.
Application
Applications (Spartan-3L FPGA EP3SL200F1152C4G):
- Industrial automation and control
- Automotive and transportation electronics
- Communications interfaces and data handling
- Digital signal processing and multimedia
- Embedded processing and glue logic for microcontrollers
- Instrumentation, medical devices, and test equipment
- Consumer electronics and smart devices
- Data acquisition and motor control
- Prototyping and FPGA-based development
- Industrial automation and control
- Automotive and transportation electronics
- Communications interfaces and data handling
- Digital signal processing and multimedia
- Embedded processing and glue logic for microcontrollers
- Instrumentation, medical devices, and test equipment
- Consumer electronics and smart devices
- Data acquisition and motor control
- Prototyping and FPGA-based development
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