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EP3C55F780C7N
IC FPGA 377 I/O 780FBGA
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- 製造商。 部分 #EP3C55F780C7N
- 包 FBGA-780
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規格
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3491 |
| NumberofLogicElements/Cells | 55856 |
| TotalRAMBits | 2396160 |
| NumberofI/O | 377 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 780-BGA |
概述
Description
The EP3C55F780C7N is a member of the Cyclone III FPGA family produced by Intel (formerly Altera). It features a total of 55,000 logic elements, which are configurable to implement various digital circuits and systems. This FPGA is designed for low power consumption, making it suitable for a wide range of applications in embedded systems, automotive, consumer electronics, and communication devices.
Key specifications include a maximum clock frequency of around 200 MHz, support for multiple I/O standards, and a significant number of embedded multipliers and memory blocks. The EP3C55F780C7N also integrates a JTAG interface for programming and debugging, facilitating easier development. Its combination of performance, flexibility, and efficiency allows designers to create complex digital designs while optimizing power usage and cost. Overall, the EP3C55F780C7N is ideal for applications requiring a balance of performance, resource availability, and energy efficiency.
Key specifications include a maximum clock frequency of around 200 MHz, support for multiple I/O standards, and a significant number of embedded multipliers and memory blocks. The EP3C55F780C7N also integrates a JTAG interface for programming and debugging, facilitating easier development. Its combination of performance, flexibility, and efficiency allows designers to create complex digital designs while optimizing power usage and cost. Overall, the EP3C55F780C7N is ideal for applications requiring a balance of performance, resource availability, and energy efficiency.
Features
The EP3C55F780C7N is a member of Intel's Cyclone III FPGA family, designed for low-cost, low-power applications. Key features include:
- Logic Elements: 55,000 logic elements, allowing for substantial design flexibility.
- Embedded Memory: Up to 2.1 Mbits of embedded memory, supporting various data storage needs.
- DSP Blocks: Contains up to 36 multipliers, facilitating efficient signal processing tasks.
- I/O Pins: 780 programmable I/O pins, providing ample connectivity options.
- Speed Grade: Rated for a speed grade of -7, allowing for high-performance operation.
- Power Consumption: Features low static and dynamic power consumption, suitable for energy-efficient designs.
- Advanced Features: Supports up to 8 PLLs and a range of communication interfaces, including LVDS, SPI, and I2C.
This FPGA is ideal for applications in telecommunications, automotive, and industrial control systems where performance, efficiency, and cost-effectiveness are crucial.
- Logic Elements: 55,000 logic elements, allowing for substantial design flexibility.
- Embedded Memory: Up to 2.1 Mbits of embedded memory, supporting various data storage needs.
- DSP Blocks: Contains up to 36 multipliers, facilitating efficient signal processing tasks.
- I/O Pins: 780 programmable I/O pins, providing ample connectivity options.
- Speed Grade: Rated for a speed grade of -7, allowing for high-performance operation.
- Power Consumption: Features low static and dynamic power consumption, suitable for energy-efficient designs.
- Advanced Features: Supports up to 8 PLLs and a range of communication interfaces, including LVDS, SPI, and I2C.
This FPGA is ideal for applications in telecommunications, automotive, and industrial control systems where performance, efficiency, and cost-effectiveness are crucial.
Package
The EP3C55F780C7N is packaged in a 780-pin Fine-Pitch Ball Grid Array (FBGA) format. This type of package is designed for high-density applications, providing efficient thermal and electrical performance.
Pinout
The EP3C55F780C7N is a part of Intel's Cyclone III FPGA family. It has a pin count of 780 pins.
This FPGA is designed for high performance and low power applications, featuring a range of input/output (I/O) options, including LVTTL, LVCMOS, and others. The device supports various functionalities such as digital signal processing, high-speed data interfaces, and custom logic implementations.
Key features include:
- 55,000 usable logic elements (LEs)
- Embedded memory blocks and DSP blocks
- Configurable I/O standards
- Support for various communication protocols
This combination of features makes the EP3C55F780C7N suitable for applications in telecommunications, automotive, industrial control, and consumer electronics.
This FPGA is designed for high performance and low power applications, featuring a range of input/output (I/O) options, including LVTTL, LVCMOS, and others. The device supports various functionalities such as digital signal processing, high-speed data interfaces, and custom logic implementations.
Key features include:
- 55,000 usable logic elements (LEs)
- Embedded memory blocks and DSP blocks
- Configurable I/O standards
- Support for various communication protocols
This combination of features makes the EP3C55F780C7N suitable for applications in telecommunications, automotive, industrial control, and consumer electronics.
Manufacturer
The EP3C55F780C7N is manufactured by Intel Corporation, specifically as part of their FPGA (Field-Programmable Gate Array) product line. Intel is a multinational technology company headquartered in Santa Clara, California. It is well-known for designing and manufacturing semiconductor products, including microprocessors, integrated circuits, and various hardware solutions.
Intel operates in the high-tech sector and is one of the largest and most influential companies in the semiconductor industry. The company serves a wide range of markets, including computing, data centers, artificial intelligence, and the Internet of Things (IoT). Their FPGA offerings, like the EP3C55F780C7N, provide flexible and customizable hardware solutions for various applications, from telecommunications to automotive systems and beyond.
Intel operates in the high-tech sector and is one of the largest and most influential companies in the semiconductor industry. The company serves a wide range of markets, including computing, data centers, artificial intelligence, and the Internet of Things (IoT). Their FPGA offerings, like the EP3C55F780C7N, provide flexible and customizable hardware solutions for various applications, from telecommunications to automotive systems and beyond.
Application
The EP3C55F780C7N is a FPGA (Field Programmable Gate Array) from Intel, primarily used in applications such as digital signal processing, communications, embedded systems, and industrial automation. It is suitable for high-performance computing tasks, including video and image processing, as well as for prototyping and custom hardware solutions in various fields like automotive, aerospace, and medical devices.
Equivalent
The EP3C55F780C7N is an Altera Cyclone III FPGA. Equivalent products include Xilinx Spartan-6 FPGA series (e.g., XC6SLX45), Lattice Semiconductor's ECP3 series, and Microsemi's SmartFusion2 FPGAs. When considering alternatives, check for equivalent logic resources, power consumption, I/O capabilities, and specific application requirements.
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