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EP2S60F672I4
IC FPGA 492 I/O 672FBGA
- 製造商
- 製造商。 部分 #EP2S60F672I4
- 包 672-BBGA
- 資料表
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規格
| Supplier | Intel |
| Package | Tray |
| Series | Stratix® II |
| ProductStatus | Obsolete |
| NumberofLABs/CLBs | 3022 |
| NumberofLogicElements/Cells | 60440 |
| TotalRAMBits | 2544192 |
| NumberofI/O | 492 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 672-BBGA |
概述
Description
EP2S60F672I4 is an Intel/Altera Cyclone II FPGA device. It comes in a 672-pin FineLine BGA package and encodes a mid‑density part: about 60k logic elements (EP2S60), with industrial temperature range (I) and speed grade 4 (I4).
Key points:
- Intermediate-density Cyclone II FPGA with LUTs/flip‑flops, RAM blocks (M9K on Cyclone II), PLLs, and multiple I/O banks.
- 672-pin package supports a variety of I/O configurations for wide interfaces.
- Suitable for cost‑sensitive, mid‑range designs: embedded controllers, data paths, interface glue logic, and similar applications.
- Design flow via Intel Quartus II (or later) and programming hardware such as USB-Blaster.
Note: For exact resource counts, RAM block details, I/O counts per bank, voltage, and timing specs, consult the official datasheet and package documentation.
Key points:
- Intermediate-density Cyclone II FPGA with LUTs/flip‑flops, RAM blocks (M9K on Cyclone II), PLLs, and multiple I/O banks.
- 672-pin package supports a variety of I/O configurations for wide interfaces.
- Suitable for cost‑sensitive, mid‑range designs: embedded controllers, data paths, interface glue logic, and similar applications.
- Design flow via Intel Quartus II (or later) and programming hardware such as USB-Blaster.
Note: For exact resource counts, RAM block details, I/O counts per bank, voltage, and timing specs, consult the official datasheet and package documentation.
Features
EP2S60F672I4 is a Stratix II FPGA device. Key features include:
- About 60K logic elements (LEs) for flexible, high-density logic
- 672-pin FineLine BGA package
- Industrial temperature range (-40 to 85°C)
- Rich on-chip memory: embedded RAM blocks for data storage
- DSP resources with multiple 9x9 (and similar) multipliers for signal processing
- Flexible clocking: multiple PLLs and clock-management resources (DCMs)
- Multi-bank I/O with a wide range of standards; 3.3V-tolerant I/O in suitable banks
- Large I/O count across several banks for extensive external connectivity
- JTAG boundary-scan and in-system programming support
- Various configuration options (serial, parallel, etc.) and on-chip configuration memory
- Suitable for high-performance DSP, communications, data processing, and other dense logic applications
Note: exact I/O counts and memory sizes vary by package and bank configuration.
- About 60K logic elements (LEs) for flexible, high-density logic
- 672-pin FineLine BGA package
- Industrial temperature range (-40 to 85°C)
- Rich on-chip memory: embedded RAM blocks for data storage
- DSP resources with multiple 9x9 (and similar) multipliers for signal processing
- Flexible clocking: multiple PLLs and clock-management resources (DCMs)
- Multi-bank I/O with a wide range of standards; 3.3V-tolerant I/O in suitable banks
- Large I/O count across several banks for extensive external connectivity
- JTAG boundary-scan and in-system programming support
- Various configuration options (serial, parallel, etc.) and on-chip configuration memory
- Suitable for high-performance DSP, communications, data processing, and other dense logic applications
Note: exact I/O counts and memory sizes vary by package and bank configuration.
Package
FineLine BGA (FBGA) 672-ball package (FBGA672).
Pinout
- Pin count: 672 pins
- Function: Altera Stratix II FPGA (EP2S60) with ~60K logic elements; a high-density, programmable logic device.
- Function: Altera Stratix II FPGA (EP2S60) with ~60K logic elements; a high-density, programmable logic device.
Manufacturer
- Manufacturer: Altera Corporation (now Intel FPGA, a business unit of Intel).
- Company type: A semiconductor company that designs and manufactures programmable logic devices, specifically FPGAs and related components.
- Company type: A semiconductor company that designs and manufactures programmable logic devices, specifically FPGAs and related components.
Application
Common application areas for EP2S60F672I4 include:
- Digital signal processing and image/video processing pipelines
- Embedded systems with custom peripherals and interfaces
- Communications and networking (PCI/PCI‑X bridges, high‑speed serial)
- Data acquisition, test and measurement equipment
- Motor control and industrial automation
- Prototyping/ASIC emulation for complex logic tasks
- Digital signal processing and image/video processing pipelines
- Embedded systems with custom peripherals and interfaces
- Communications and networking (PCI/PCI‑X bridges, high‑speed serial)
- Data acquisition, test and measurement equipment
- Motor control and industrial automation
- Prototyping/ASIC emulation for complex logic tasks
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