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EP2AGX125EF29C6N
IC FPGA 372 I/O 780FBGA
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規格
| Series | Arria II GX |
| Part Status | Obsolete |
| Base Product Number | EP2AGX125 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 4964 |
| Number of Logic Elements/Cells | 118143 |
| Total RAM Bits | 8315904 |
| Number of I/O | 372 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29x29) |
| Packaging | Tray |
概述
Description
EP2AGX125EF29C6N is an Intel (Altera) FPGA part from the Arria II GX family. The “125” typically denotes about 125k logic elements. It’s a 65 nm device with on‑chip memory blocks, DSP blocks, and multi‑gigabit SERDES for high‑speed I/O. The “C6N” suffix refers to its packaging option (a specific BGA/ball-grid package). It’s programmed with Intel’s Quartus Prime design software and used for flexible, reconfigurable logic in applications such as communications, signal processing, and embedded interfaces. For exact specifications (element count, RAM/DSP blocks, transceiver count, I/O banks and voltage requirements), consult the official Arria II GX datasheet and user guide.
Features
EP2AGX125EF29C6N is a Cyclone V GX FPGA. Key features:
- About 125,000 logic elements (LEs)
- Embedded memory blocks (M9K blocks) for on-chip RAM
- DSP blocks for signal processing
- Clock management via multiple PLLs
- High-speed transceivers (GTx) for SERDES applications
- Multiple I/O banks with varied voltage tolerance and drive options
- Optimized for low power in dense FPGA designs
Note: exact memory size, DSP block count, and transceiver speeds can vary by package; consult the datasheet for precise specifications for your specific package option.
- About 125,000 logic elements (LEs)
- Embedded memory blocks (M9K blocks) for on-chip RAM
- DSP blocks for signal processing
- Clock management via multiple PLLs
- High-speed transceivers (GTx) for SERDES applications
- Multiple I/O banks with varied voltage tolerance and drive options
- Optimized for low power in dense FPGA designs
Note: exact memory size, DSP block count, and transceiver speeds can vary by package; consult the datasheet for precise specifications for your specific package option.
Package
FBGA package (Fine-pitch Ball Grid Array), 29 × 29 mm.
Pinout
Pin count: 1152 pins (FineLine BGA package, EF29C6N variant).
Function: An Altera/Intel Cyclone GX FPGA device (EP2AGX125...), ~125K logic elements, providing programmable logic, embedded memory, DSP blocks, IO banks, and high‑speed transceivers for digital design and interfacing.
Function: An Altera/Intel Cyclone GX FPGA device (EP2AGX125...), ~125K logic elements, providing programmable logic, embedded memory, DSP blocks, IO banks, and high‑speed transceivers for digital design and interfacing.
Manufacturer
Manufacturer: Altera Corporation (now part of Intel).
What kind of company: A semiconductor company that designs and manufactures programmable logic devices (FPGAs, CPLDs) and related components.
What kind of company: A semiconductor company that designs and manufactures programmable logic devices (FPGAs, CPLDs) and related components.
Application
Applications include high-end communications and data networking, software-defined radio, optical transport, and data-center acceleration; video/image processing and surveillance; embedded vision; radar/defense, aerospace; automotive sensing and ADAS; medical imaging; and industrial control. It’s used where DSP throughput, high-speed SERDES, and flexible I/O are required.
Equivalent
Direct equivalents from other vendors do not exist for EP2AGX125EF29C6N. It is an Intel/Altera Cyclone V GX FPGA with 125K logic elements in a C6N package. The closest substitutes are other Cyclone V GX parts with the same capacity in the same package (within the EP2AGX125 family). For exact substitutes, use distributor cross-reference tools (Digi-Key, Mouser) or Intel’s cross-reference utility.
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