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DS90LV001TMX
IC REDRIVER LVDS 1CH 8SOIC
- 製造商
- 製造商。 部分 #DS90LV001TMX
- 包 8-SOIC (0.154, 3.90mm Width)
- 資料表 DS90LV001TMX DataSheet
- 有現貨的5646
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規格
| Supplier | Texas Instruments,Rochester Electronics, LLC |
| Package | Tape & Reel (TR),Cut Tape (CT),Bulk |
| ProductStatus | Not For New Designs |
| Type | Buffer, ReDriver |
| Applications | LVDS |
| Input | CML, LVDS, LVPECL |
| Output | LVDS |
| DataRate(Max) | 800Mbps |
| NumberofChannels | 1 |
| DelayTime | 1.4ns |
| Voltage-Supply | 3V ~ 3.6V |
| Current-Supply | 47mA |
| OperatingTemperature | -40°C ~ 85°C |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
概述
Description
DS90LV001TMX is Texas Instruments’ LVDS (low-voltage differential signaling) transceiver. It provides a high-speed serial link on a single channel, enabling robust, long-distance data transmission over twisted-pair with low noise/EMI. The TMX suffix denotes Tape & Reel packaging for automated assembly. It’s commonly used to connect sensors or cameras to processors, displays, or other data-processing devices. For exact data rates, supply voltage, pinout, and other electrical specs, see the DS90LV001 data sheet.
Features
DS90LV001TMX features (concise):
- 1:2 LVDS fanout buffer: one LVDS input drives two identical LVDS outputs
- Fully differential LVDS signaling with 100 Ω differential load
- Single-supply operation at 3.3 V (typical range 3.0–3.6 V)
- High-speed, suitable for video/data links; low skew between outputs
- Enable/Disable (OE) control to tri-state outputs
- Low jitter and tight propagation delay matching
- Compact 8-pin package (MX family/Tape & Reel variant)
- ESD protection on I/O; robust for consumer/industrial use
- Temperature range: -40 °C to +85 °C
Note: exact electrical specs (speed, skew, noise margins) and termination options vary by device revision; consult the TI DS90LV001 datasheet for precise figures.
- 1:2 LVDS fanout buffer: one LVDS input drives two identical LVDS outputs
- Fully differential LVDS signaling with 100 Ω differential load
- Single-supply operation at 3.3 V (typical range 3.0–3.6 V)
- High-speed, suitable for video/data links; low skew between outputs
- Enable/Disable (OE) control to tri-state outputs
- Low jitter and tight propagation delay matching
- Compact 8-pin package (MX family/Tape & Reel variant)
- ESD protection on I/O; robust for consumer/industrial use
- Temperature range: -40 °C to +85 °C
Note: exact electrical specs (speed, skew, noise margins) and termination options vary by device revision; consult the TI DS90LV001 datasheet for precise figures.
Package
The DS90LV001TMX is supplied in a 16-pin SOIC package (SOIC-16, narrow-body), typically shipped on tape-and-reel.
Manufacturer
Manufacturer: Texas Instruments (TI).
Type of company: TI is an American multinational semiconductor company (headquartered in Dallas, Texas) that designs and manufactures integrated circuits and semiconductor devices—especially analog chips, embedded processors, and other components used across consumer, industrial, automotive, and communications markets.
Type of company: TI is an American multinational semiconductor company (headquartered in Dallas, Texas) that designs and manufactures integrated circuits and semiconductor devices—especially analog chips, embedded processors, and other components used across consumer, industrial, automotive, and communications markets.
Application
DS90LV001TMX is a low‑voltage differential signaling (LVDS) line driver/receiver for high‑speed digital video and data links. Typical applications include:
- Automotive camera systems (rear/backup, ADAS, driver monitoring)
- Display/video links for LCD/TFT panels
- Industrial/machine‑vision and medical imaging cameras
- Surveillance/security camera systems
- Any point‑to‑point LVDS link requiring low power and small form factor
- Automotive camera systems (rear/backup, ADAS, driver monitoring)
- Display/video links for LCD/TFT panels
- Industrial/machine‑vision and medical imaging cameras
- Surveillance/security camera systems
- Any point‑to‑point LVDS link requiring low power and small form factor
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