CL32A107MQVNNNE

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CL32A107MQVNNNE

CAP CER 100UF 6.3V X5R 1210

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規格

Series CL
Part Status Active
Capacitance 100 µF
Tolerance ±20%
Voltage - Rated 6.3V
Temperature Coefficient X5R
Operating Temperature -55°C ~ 85°C
Applications General Purpose
Mounting Type Surface Mount, MLCC
Package 1210 (3225 Metric)
Size / Dimension 0.126" L x 0.098" W (3.20mm x 2.50mm)
Thickness (Max) 0.110" (2.80mm)
Packaging Cut Tape (CT), Tape & Reel (TR)

概述

Description

CL32A107MQVNNNE is a surface-mount multilayer ceramic capacitor (MLCC). The “107” code means a nominal capacitance of 10 µF (10,000,000 pF). The “CL32” portion indicates the size/series of the capacitor, used for decoupling and filtering in compact boards. The remaining letters (A MQV NNNE) encode dielectric type, voltage rating, tolerance, temperature characteristic, termination, and packaging, but exact values vary by manufacturer.
Key points:
- Type: MLCC (ceramic capacitor)
- Capacitance: around 10 µF
- Purpose: power rail decoupling, smoothing, noise filtering
For precise specs (voltage rating, dielectric class like X7R/X5R, tolerance, temperature behavior, termination finish), consult the manufacturer’s datasheet or BOM documentation for this exact part number.

Package

CL32A107MQVNNNE is in a QFN-style surface-mount package (32 pins). For exact body size and land pattern, refer to the manufacturer’s datasheet.

Pinout

Pin count: 2 pins. Function: 100 µF multi‑layer ceramic capacitor (MLCC) used for decoupling/energy storage.

Manufacturer

Manufacturer: Chilisin Electronics Corp.
What kind of company: A Taiwanese-based manufacturer of passive electronic components, primarily chip inductors, ferrite beads and EMI filters used in consumer, automotive, and industrial electronics.

Application

CL32A107MQVNNNE is a 100 µF multilayer ceramic capacitor (MLCC) in the CL32A family. Typical application areas:
- Power-supply decoupling and bypass on CPUs/MCUs/FPGA and analog ICs
- Filtering and smoothing for switching regulators (DC-DC converters)
- Energy storage/bulk decoupling in portable devices, wearables, and IoT
- EMI/RFI suppression and general-purpose bypass in consumer electronics, automotive, and industrial electronics

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