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BGM113A256V21R
RF TXRX MOD BLUETOOTH CHIP SMD
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規格
| Series | Blue Gecko |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| RF Family/Standard | Bluetooth |
| Protocol | Bluetooth v4.2 |
| Modulation | GFSK |
| Frequency | 2.4GHz ~ 2.484GHz |
| Data Rate | 1Mbps |
| Power - Output | 3dBm |
| Sensitivity | -92dBm |
| Serial Interfaces | I2C, I2S, SPI, UART, USART |
| Antenna Type | Integrated, Chip |
| Utilized IC / Part | EFR32BG |
| Memory Size | 256kB Flash, 32kB RAM |
| Voltage - Supply | 1.85V ~ 3.8V |
| Current - Receiving | 9mA |
| Current - Transmitting | 8.2mA ~ 24.6mA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 36-SMD Module |
| Base Product Number | BGM113 |
概述
Description
The BGM113A256V21R is a Bluetooth module designed by Silicon Labs. It integrates the Bluetooth 4.2 low energy (BLE) technology, making it ideal for low-power wireless communication applications. This module is part of the Blue Gecko family and is known for its compact size, energy efficiency, and robust performance.
Key features include a built-in ARM Cortex-M4 processor, 256 kB of flash memory, and 32 kB of RAM, which allow for significant on-board application development and storage. It supports various interfaces such as UART, SPI, and I2C, providing flexibility in connecting with different peripherals.
The BGM113A256V21R is particularly useful in Internet of Things (IoT) applications, wearable technology, and smart home devices due to its low power consumption and strong connectivity capabilities. It also offers a high level of security features, including AES encryption, ensuring secure data transmission.
Additionally, it comes with a comprehensive development environment that includes software tools and documentation, making it easier for developers to design and implement their BLE-based projects.
Key features include a built-in ARM Cortex-M4 processor, 256 kB of flash memory, and 32 kB of RAM, which allow for significant on-board application development and storage. It supports various interfaces such as UART, SPI, and I2C, providing flexibility in connecting with different peripherals.
The BGM113A256V21R is particularly useful in Internet of Things (IoT) applications, wearable technology, and smart home devices due to its low power consumption and strong connectivity capabilities. It also offers a high level of security features, including AES encryption, ensuring secure data transmission.
Additionally, it comes with a comprehensive development environment that includes software tools and documentation, making it easier for developers to design and implement their BLE-based projects.
Features
The BGM113A256V21R is a Bluetooth Smart Module designed for low-energy applications. Key features include:
1. Bluetooth Low Energy (BLE) 4.2: Offers efficient wireless connectivity with low power consumption.
2. Integrated Antenna: Simplifies design and reduces the need for external components.
3. ARM Cortex-M4: Equipped with a 32-bit MCU that includes a Floating Point Unit (FPU) for enhanced processing capabilities.
4. 256 kB Flash Memory: Provides significant storage space for application code and data.
5. 32 kB RAM: Ensures efficient operation and data handling.
6. Compact Design: Measures only 12.9 mm x 15.0 mm x 2.2 mm, making it suitable for space-constrained applications.
7. UART, I2C, SPI interfaces: Allows for flexible connectivity with other devices.
8. Security Features: Supports AES encryption for secure data transmission.
9. Temperature Range: Operates effectively between -40°C to +85°C, suitable for various environments.
10. Regulatory Certifications: Pre-certified for use in multiple regions, reducing the time and cost for device certification.
This module is ideal for applications such as smart homes, health and fitness devices, and industrial automation.
1. Bluetooth Low Energy (BLE) 4.2: Offers efficient wireless connectivity with low power consumption.
2. Integrated Antenna: Simplifies design and reduces the need for external components.
3. ARM Cortex-M4: Equipped with a 32-bit MCU that includes a Floating Point Unit (FPU) for enhanced processing capabilities.
4. 256 kB Flash Memory: Provides significant storage space for application code and data.
5. 32 kB RAM: Ensures efficient operation and data handling.
6. Compact Design: Measures only 12.9 mm x 15.0 mm x 2.2 mm, making it suitable for space-constrained applications.
7. UART, I2C, SPI interfaces: Allows for flexible connectivity with other devices.
8. Security Features: Supports AES encryption for secure data transmission.
9. Temperature Range: Operates effectively between -40°C to +85°C, suitable for various environments.
10. Regulatory Certifications: Pre-certified for use in multiple regions, reducing the time and cost for device certification.
This module is ideal for applications such as smart homes, health and fitness devices, and industrial automation.
Package
The BGM113A256V21R is a Bluetooth module from Silicon Labs. It features a compact PCB package designed for easy integration into IoT devices and applications. The module includes a Bluetooth 4.2 compliant radio, integrated antenna, and ARM Cortex-M4 processor, making it suitable for low-power wireless communication.
Pinout
The BGM113A256V21R is a Bluetooth Module from Silicon Labs. It is part of the BGM113 series, which integrates a Bluetooth Low Energy (BLE) SoC and an onboard antenna for wireless communication. The module typically has a small form factor and is designed for easy integration into various applications requiring Bluetooth connectivity.
As for the pin count, the BGM113 module features 32 pins. These pins serve various functions, including power supply, ground, GPIO (General Purpose Input/Output), UART (Universal Asynchronous Receiver/Transmitter), SPI (Serial Peripheral Interface), I2C (Inter-Integrated Circuit), and ADC (Analog-to-Digital Converter) inputs. Additionally, some pins are designated for control signals, reset, and programming/debugging interfaces. The specific pin configuration and functions can be found in the module's datasheet or technical reference manual, which provides detailed information on how to interface and utilize the module effectively in a design.
As for the pin count, the BGM113 module features 32 pins. These pins serve various functions, including power supply, ground, GPIO (General Purpose Input/Output), UART (Universal Asynchronous Receiver/Transmitter), SPI (Serial Peripheral Interface), I2C (Inter-Integrated Circuit), and ADC (Analog-to-Digital Converter) inputs. Additionally, some pins are designated for control signals, reset, and programming/debugging interfaces. The specific pin configuration and functions can be found in the module's datasheet or technical reference manual, which provides detailed information on how to interface and utilize the module effectively in a design.
Manufacturer
The BGM113A256V21R is manufactured by Silicon Labs. Silicon Labs is a technology company that specializes in designing and developing semiconductors, microcontrollers, and silicon software solutions. They cater to a variety of industries, including the Internet of Things (IoT), automotive, industrial automation, and consumer electronics. Silicon Labs is known for its focus on connectivity and wireless technologies, providing solutions that enable smart infrastructure and connected devices.
Application
The BGM113A256V21R is a Bluetooth low energy module designed for wireless communication in Internet of Things (IoT) applications. It is commonly used in areas such as smart home devices, health and fitness trackers, asset tracking systems, and industrial automation. Its features, including low power consumption and compact size, make it suitable for battery-powered devices and applications requiring reliable wireless connectivity.
Equivalent
The BGM113A256V21R is a Bluetooth Low Energy (BLE) module by Silicon Labs. Equivalent products from other manufacturers include:
1. Nordic Semiconductor nRF52832 - A BLE SoC with similar capabilities.
2. Texas Instruments CC2640R2F - Another BLE solution with comparable specifications.
3. Dialog Semiconductor DA14531 - A compact BLE 5.1 chip.
4. Microchip RN4871 - BLE module with similar features.
Compatibility and specific application needs should be verified before selecting an equivalent product.
1. Nordic Semiconductor nRF52832 - A BLE SoC with similar capabilities.
2. Texas Instruments CC2640R2F - Another BLE solution with comparable specifications.
3. Dialog Semiconductor DA14531 - A compact BLE 5.1 chip.
4. Microchip RN4871 - BLE module with similar features.
Compatibility and specific application needs should be verified before selecting an equivalent product.
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