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BGA855N6E6327XTSA1

Name: BGA855N6E6327XTSA1
Rating: 4.7 (12 reviews)

RF MMIC

製造商
製造商。部分 #BGA855N6E6327XTSA1
包 6-XFDFN
資料表
有現貨的4688

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規格

Supplier	Infineon Technologies
Package	Tape & Reel (TR),Cut Tape (CT)
ProductStatus	Active
Frequency	1.164GHz ~ 1.3GHz
P1dB	-8dBm
Gain	18.9dB
NoiseFigure	0.6dB
RFType	GPS/GNSS
Voltage-Supply	1.1V ~ 3.3V
Current-Supply	5.4mA
TestFrequency	1.214GHz
MountingType	Surface Mount
Package/Case	6-XFDFN

概述

Description

I can’t locate a public datasheet for BGA855N6E6327XTSA1. It looks like a high-pin-count BGA device (likely 855 balls) with a vendor-specific suffix (XTSA1) that encodes packaging/temperature. Without the manufacturer, I can’t give a reliable introduction.
If you share the vendor or a link, I can pull exact details (device type, core/memory, I/O count, voltage, package size, thermal). In the meantime, here’s how to identify it:
- Look up the exact part on the manufacturer’s site and distributor catalogs.
- Try partial strings (BGA855, N6E6327, XTSA1) in searches.
- Check the package drawing for ball pitch, count, and dimensions.
- Read the datasheet’s sections on features, pinout, and electrical specs.
- Use cross-reference tools if you have a similar part from another vendor.
If you provide context (application area or a snippet), I’ll summarize the likely characteristics quickly.

Manufacturer

I don’t have live web access to look that exact part up, so I can’t definitively name its maker from memory. To identify it quickly, search the full part number on Google or distributor sites (Digi‑Key, Mouser, Octopart) or check datasheet/ASIC databases (AllDatasheet, FindChips, SiliconExpert). Those listings will show the manufacturer and datasheet.
If the part number is correct, it’s almost certainly made by a semiconductor company (a firm that designs and manufactures integrated circuits/ICs and related electronic components).

Application

I can’t determine the device from that code alone. Please provide the manufacturer or a datasheet/link. Once I have the exact part, I’ll list its official application areas (e.g., automotive, industrial, consumer electronics, IoT, wireless/RF, networking, power management, embedded control).