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BALF-NRF01D3
BALUN 2.4GHZ-2.5GHZ 50/50 5UFBGA
- 製造商
- 製造商。 部分 #BALF-NRF01D3
- 包 5-UFBGA,FCBGA
- 資料表 BALF-NRF01D3 DataSheet
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規格
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| FrequencyRange | 2.4GHz ~ 2.5GHz |
| Impedance-Unbalanced/Balanced | 50 / 50Ohm |
| PhaseDifference | 5° |
| InsertionLoss(Max) | 1.5dB |
| ReturnLoss(Min) | -17.5dB |
| Package/Case | 5-UFBGA, FCBGA |
概述
Description
BALF-NRF01D3 is a specialized component often utilized in advanced electronic or communication systems. Its primary function typically involves facilitating specific signal processing or enhancing connectivity within a network. The "BALF" designation generally refers to a type of balun filter, which is a device used to convert between balanced and unbalanced signals, crucial for minimizing interference and improving signal integrity in radio frequency applications. The model number "NRF01D3" suggests a specific iteration or design specification within this line, indicating unique features or performance metrics that distinguish it from other models. These components are critical in achieving optimal performance in devices that require precise signal management, such as wireless communication equipment, where they contribute to the efficient handling of radio frequencies and the reduction of noise.
Features
The BALF-NRF01D3 is a compact, versatile RF front-end module designed for Bluetooth applications. Key features include:
1. Frequency Range: Optimized for the 2.4 GHz ISM band, which is standard for Bluetooth communication.
2. Integration: Combines filtering, matching, and balun functions in a single package, reducing the need for additional external components.
3. Size: Offers a small form factor, making it ideal for space-constrained applications, such as wearable devices or compact IoT gadgets.
4. Performance: Provides low insertion loss and high out-of-band rejection, ensuring efficient and reliable signal processing.
5. Compatibility: Designed to work seamlessly with popular Bluetooth chipsets, simplifying design and reducing development time.
6. Power Handling: Supports adequate power levels for most Bluetooth applications, ensuring robust performance without compromising efficiency.
7. Environmental Resilience: Built to withstand standard environmental conditions, making it suitable for a wide range of consumer and industrial applications.
These features make the BALF-NRF01D3 an efficient solution for enhancing Bluetooth device performance while minimizing design complexity.
1. Frequency Range: Optimized for the 2.4 GHz ISM band, which is standard for Bluetooth communication.
2. Integration: Combines filtering, matching, and balun functions in a single package, reducing the need for additional external components.
3. Size: Offers a small form factor, making it ideal for space-constrained applications, such as wearable devices or compact IoT gadgets.
4. Performance: Provides low insertion loss and high out-of-band rejection, ensuring efficient and reliable signal processing.
5. Compatibility: Designed to work seamlessly with popular Bluetooth chipsets, simplifying design and reducing development time.
6. Power Handling: Supports adequate power levels for most Bluetooth applications, ensuring robust performance without compromising efficiency.
7. Environmental Resilience: Built to withstand standard environmental conditions, making it suitable for a wide range of consumer and industrial applications.
These features make the BALF-NRF01D3 an efficient solution for enhancing Bluetooth device performance while minimizing design complexity.
Package
The BALF-NRF01D3 is a multi-layer ceramic package designed for use in RF front-end modules. It provides a compact size and efficient integration for Bluetooth and Wi-Fi applications, enhancing RF performance while minimizing space in mobile and IoT devices.
Manufacturer
The BALF-NRF01D3 is manufactured by Murata Manufacturing Co., Ltd. Murata is a Japanese company that specializes in the design, manufacture, and supply of electronic components, modules, and devices. Founded in 1944, Murata is known for its innovation in the electronics industry and produces a wide range of products including capacitors, sensors, wireless modules, and more. The company serves various markets, including automotive, healthcare, and industrial sectors, by providing high-tech solutions and components. Murata is recognized globally for its commitment to quality and technological advancement.
Application
The BALF-NRF01D3 is primarily used in wireless communication applications. It is a specialized chip that integrates a balun with an impedance matching network, optimized for use with RF modules in Bluetooth, Wi-Fi, and other short-range wireless communication devices. Its compact size and efficiency make it suitable for use in mobile devices, IoT applications, and consumer electronics where space and performance are critical considerations.
Equivalent
The BALF-NRF01D3 is a Balun specifically designed for use with Nordic Semiconductor's nRF51 and nRF52 series. Equivalent products include Murata's LFB182G45BG2D280, Johanson Technology's 2450BM14A0002 balun, and TDK's HHM1595B1 balun. These components are designed to match the impedance and frequency requirements for similar Bluetooth Low Energy applications. Always verify compatibility with specific design requirements and manufacturer datasheets.
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