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ADC08D1500CIYB
IC ADC 8BIT FOLD INTERP 128HLQFP
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- 製造商。 部分 #ADC08D1500CIYB
- 包 128-LQFP Exposed Pad
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規格
| Supplier | Texas Instruments |
| Package | Tray |
| ProductStatus | Obsolete |
| NumberofBits | 8 |
| SamplingRate(PerSecond) | 1.5G |
| NumberofInputs | 2 |
| InputType | Differential |
| DataInterface | LVDS - Parallel |
| Configuration | MUX-S/H-ADC |
| Ratio-S/H:ADC | 1:1 |
| NumberofA/DConverters | 2 |
| Architecture | Folding Interpolating |
| ReferenceType | Internal |
| Voltage-SupplyAnalog | 1.8V ~ 2V |
| Voltage-SupplyDigital | 1.8V ~ 2V |
| Features | Simultaneous Sampling |
| OperatingTemperature | -40°C ~ 85°C |
| Package/Case | 128-LQFP Exposed Pad |
| SupplierDevicePackage | 128-HLQFP (20x20) |
概述
Description
ADC08D1500CIYB is a Texas Instruments high‑speed, eight‑channel, 8‑bit ADC. It converts eight analog inputs into a high‑speed digital stream at up to about 1.5 GSPS (total throughput). It requires an external reference and clock, plus basic control signals (reset/data framing). Data is output over a high‑speed interface (configurable by device; typically parallel/serial data paths). The CIYB suffix denotes a specific package/temperature grade—see the TI datasheet for exact pinout and package details.
Typical uses include RF/ Communications front ends, radar, high‑speed data acquisition, and instrumentation. Design notes: ensure clean clock, proper input conditioning and reference within spec, manage thermal dissipation, and follow timing/alignment requirements per the datasheet. For detailed electrical specs, timing diagrams, and packaging, consult the ADC08D1500 product page and datasheet on TI’s site.
Typical uses include RF/ Communications front ends, radar, high‑speed data acquisition, and instrumentation. Design notes: ensure clean clock, proper input conditioning and reference within spec, manage thermal dissipation, and follow timing/alignment requirements per the datasheet. For detailed electrical specs, timing diagrams, and packaging, consult the ADC08D1500 product page and datasheet on TI’s site.
Features
Key features of ADC08D1500CIYB (8-bit, 1.5 GSPS):
- 8-bit resolution
- Up to 1.5 gigasamples per second (1.5 GSPS) throughput
- Differential LVDS output interface (high-speed data with clock)
- On-chip track-and-hold
- Industrial temperature range: -40°C to +85°C
- Packaging: CIYB (48-pin package)
- Suitable for high-speed applications: communications, radar, imaging, instrumentation
Note: Power and other analog I/O specifics vary by revision; refer to the datasheet for exact electrical characteristics.
- 8-bit resolution
- Up to 1.5 gigasamples per second (1.5 GSPS) throughput
- Differential LVDS output interface (high-speed data with clock)
- On-chip track-and-hold
- Industrial temperature range: -40°C to +85°C
- Packaging: CIYB (48-pin package)
- Suitable for high-speed applications: communications, radar, imaging, instrumentation
Note: Power and other analog I/O specifics vary by revision; refer to the datasheet for exact electrical characteristics.
Package
ADC08D1500CIYB is in an 80‑pin LQFP (Thin Quad Flat Pack) package.
Pinout
- Pin count: 256 pins (BGA package, CIYB).
- Function: High-speed 8-bit analog-to-digital converter (ADC08D1500) at 1.5 GSPS, with parallel LVDS 8-bit digital outputs and clock/convert-control pins (e.g., CLK, CONVST, BUSY/RESET, power pins).
- Function: High-speed 8-bit analog-to-digital converter (ADC08D1500) at 1.5 GSPS, with parallel LVDS 8-bit digital outputs and clock/convert-control pins (e.g., CLK, CONVST, BUSY/RESET, power pins).
Manufacturer
- Manufacturer: Analog Devices, Inc. (ADI).
- What kind of company: A multinational American semiconductor company that designs and manufactures analog, mixed-signal, and digital signal processing (DSP) integrated circuits for various industries.
- What kind of company: A multinational American semiconductor company that designs and manufactures analog, mixed-signal, and digital signal processing (DSP) integrated circuits for various industries.
Application
ADC08D1500CIYB is an 8‑bit, 1.5‑GSPS ADC. Common application areas:
- High‑speed digital communications receivers and baseband DSP
- RF/microwave front‑end digitization (satellite, radar, microwave links)
- Wideband data acquisition and instrumentation (digitizers, sampling oscilloscope front‑ends)
- Radar, sonar and military/aerospace sensing
- Software‑defined radio and wireless infrastructure
- Optical communications front‑ends and photonic receivers
- High‑speed digital communications receivers and baseband DSP
- RF/microwave front‑end digitization (satellite, radar, microwave links)
- Wideband data acquisition and instrumentation (digitizers, sampling oscilloscope front‑ends)
- Radar, sonar and military/aerospace sensing
- Software‑defined radio and wireless infrastructure
- Optical communications front‑ends and photonic receivers
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