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A3P1000-1FGG484
IC FPGA 300 I/O 484FBGA
- 製造商
- 製造商。 部分 #A3P1000-1FGG484
- 包 484-BGA
- 資料表
- 有現貨的5977
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規格
| Supplier | Microchip Technology |
| Package | Tray |
| Series | ProASIC3 |
| ProductStatus | Active |
| TotalRAMBits | 147456 |
| NumberofI/O | 300 |
| NumberofGates | 1000000 |
| Voltage-Supply | 1.425V ~ 1.575V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 484-BGA |
概述
Description
I can’t locate a public datasheet for A3P1000-1FGG484. It likely is a vendor-specific, custom, or obsolete part number (possibly an embedded processor/SoC or ASIC). Without the manufacturer or datasheet, a precise intro isn’t possible.
A proper intro would typically cover:
- Architecture: CPU/SoC/FPGA core and fabric
- Process node and packaging (e.g., FGG484‑style BGA)
- Key peripherals and interfaces (memory, I/O, buses)
- Power, performance, and thermal characteristics
- Target applications and use cases
- Development tools and software/support
If you provide the manufacturer, a link to the datasheet, or any context (application, board, or project), I’ll give a concise, concrete overview right away.
A proper intro would typically cover:
- Architecture: CPU/SoC/FPGA core and fabric
- Process node and packaging (e.g., FGG484‑style BGA)
- Key peripherals and interfaces (memory, I/O, buses)
- Power, performance, and thermal characteristics
- Target applications and use cases
- Development tools and software/support
If you provide the manufacturer, a link to the datasheet, or any context (application, board, or project), I’ll give a concise, concrete overview right away.
Features
Here are the key features of A3P1000-1FGG484 (Actel/Microsemi ProASIC3):
- Non-volatile, flash-based FPGA (instant-on configuration)
- Approximate 1.0M system gates (A3P1000 class)
- Packaging: 484-ball FineLine BGA (FGG484)
- Multi-bank I/O with extensive pin count (hundreds of I/Os total)
- Embedded RAM: on-chip block RAM plus distributed RAM
- Clock management: programmable PLLs for flexible timing
- In-system programmable (ICP) with standard JTAG interface
- Security: bitstream encryption and protection features
- Low-power design with multiple power domains
- Design tool support for standard HDL flows and IP integration
Note: exact I/O counts, RAM sizes, and voltage ranges vary by device settings; refer to the datasheet for precise specs.
- Non-volatile, flash-based FPGA (instant-on configuration)
- Approximate 1.0M system gates (A3P1000 class)
- Packaging: 484-ball FineLine BGA (FGG484)
- Multi-bank I/O with extensive pin count (hundreds of I/Os total)
- Embedded RAM: on-chip block RAM plus distributed RAM
- Clock management: programmable PLLs for flexible timing
- In-system programmable (ICP) with standard JTAG interface
- Security: bitstream encryption and protection features
- Low-power design with multiple power domains
- Design tool support for standard HDL flows and IP integration
Note: exact I/O counts, RAM sizes, and voltage ranges vary by device settings; refer to the datasheet for precise specs.
Package
FAmiliar packaging: A3P1000-1FGG484 uses a 484-ball Fine-Pitch BGA package (FGG484).
Pinout
- Pin count: 484 pins (FGG484 package)
- Function: It’s an Actel/Microsemi A3P1000 ProASIC3 FPGA, i.e., a field-programmable gate array used to implement user digital logic.
- Function: It’s an Actel/Microsemi A3P1000 ProASIC3 FPGA, i.e., a field-programmable gate array used to implement user digital logic.
Manufacturer
- Manufacturer: Actel Corporation (the A3P1000-1FGG484 is a ProASIC3 FPGA). Actel was acquired by Microchip Technology, so today it’s available under Microchip.
- What kind of company: A semiconductor company that designs and manufactures FPGAs and other programmable logic devices (for sectors like defense, aerospace, automotive, and communications).
- What kind of company: A semiconductor company that designs and manufactures FPGAs and other programmable logic devices (for sectors like defense, aerospace, automotive, and communications).
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