5SGXEABK2H40C2G

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5SGXEABK2H40C2G

IC FPGA 696 I/O 1517HBGA

  • 製造商
  • 製造商。 部分 #5SGXEABK2H40C2G
  • 包 1517-BBGA, FCBGA
  • 資料表
  • 有現貨的5609

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規格

Supplier Intel
Package Tray
Series Stratix® V GX
ProductStatus Active
NumberofLABs/CLBs 359200
NumberofLogicElements/Cells 952000
TotalRAMBits 53248000
NumberofI/O 696
Voltage-Supply 0.87V ~ 0.93V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 1517-BBGA, FCBGA

概述

Description

5SGXEABK2H40C2G is a Xilinx FPGA device (from the 5-series family). It is a field-programmable gate array that lets you implement custom digital logic by configuring logic blocks, RAM, DSP resources, and I/O banks. The part is programmed with a bitstream using Xilinx tools (Vivado/ISE) and used for applications such as embedded systems, signal processing, communications, and rapid hardware prototyping. The suffix encodes packaging, speed grade, and temperature/voltage options (C2G and H40 refer to package and grade specifics). For exact specifications (logic cell count, block RAM, DSP slices, I/O count, supported I/O standards, clocking resources, power, and packaging), consult the official Xilinx datasheet and user guide for 5SGXEABK2H40C2G on the Xilinx website.

Package

Package type: Xilinx Virtex‑5 FPGA in an FBGA (Fine‑pitch Ball Grid Array) package. The trailing C2G denotes the exact FBGA variant. For the exact ball count and land pattern, refer to the 5SGXEABK2H40C2G datasheet or ball‑grid map.

Pinout

- Pin count: 1152-ball BGA
- Function: Xilinx Spartan‑6 GX FPGA device (5SGX…): a programmable logic device with logic cells, DSP slices and high‑speed serial transceivers.

Manufacturer

Manufacturer: Xilinx (now a subsidiary of AMD). It is a semiconductor company that designs programmable logic devices, including FPGAs, CPLDs, and SoCs; it is fabless and outsources manufacturing to foundries.

Application

5SGXEABK2H40C2G is a Stratix V FPGA. Key application areas include:
- High-speed communications infrastructure (optical transport, telecom switches/routers, backhaul)
- Data center/edge computing and network processing accelerators (packet processing, security, streaming)
- Video/graphics processing and broadcasting equipment (real-time transcoding, high‑res imaging)
- Military/aerospace and industrial automation (radar/signal processing, EW, test equipment)
- DSP/compute acceleration and research (FFT, prototyping, AI/ML inference)

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