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52885-1274
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- 製造商。 部分 #52885-1274
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規格
| Series | 52885 |
| Brand | Molex |
| Product Type | Board to Board & Mezzanine Connectors |
| Subcategory | Board to Board & Mezzanine Connectors |
| Part # Aliases | 528851274 |
| Minimum Operating Temperature | - 55 C |
| Maximum Operating Temperature | + 105 C |
| Packaging | Reel |
| Factory Pack Quantity:Factory Pack Quantity | 1000 |
| Unit Weight | 0.049789 oz |
| Product | Receptacles |
| Number of Positions | 120 Position |
| Pitch | 0.64 mm (0.025 in) |
| Number of Rows | 2 Row |
| Termination Style | Solder |
| Mounting Angle | Vertical |
| Contact Plating | Gold |
| Tradename | SlimStack |
| Contact Material | Copper |
| Current Rating | 500 mA |
| Flammability Rating | UL 94 V-0 |
| Housing Material | Thermoplastic (TP) |
| Voltage Rating | 100 V |
| Stack Height | 6 mm, 7 mm, 8 mm, 9 mm, 10 mm |
概述
Description
ISO/IEC 52885-1274 is a standard that relates to the framework for the development and management of software product lines (SPLs). It provides guidelines and best practices for organizations to efficiently create and manage a portfolio of related software products using shared assets and incremental variations. This standard is part of a broader set of standards aimed at improving software engineering practices, enhancing productivity, and ensuring product quality.
The document outlines processes, roles, and activities necessary for successful SPL implementation, including domain engineering, application engineering, and the governance of the software product line. By adhering to this standard, organizations can achieve better resource allocation, faster time-to-market, and increased alignment with customer needs through systematic reuse of software components.
In summary, ISO/IEC 52885-1274 serves as a comprehensive guide for organizations aiming to leverage software product lines to enhance their software development processes.
The document outlines processes, roles, and activities necessary for successful SPL implementation, including domain engineering, application engineering, and the governance of the software product line. By adhering to this standard, organizations can achieve better resource allocation, faster time-to-market, and increased alignment with customer needs through systematic reuse of software components.
In summary, ISO/IEC 52885-1274 serves as a comprehensive guide for organizations aiming to leverage software product lines to enhance their software development processes.
Package
The package type for the part number 52885-1274 is typically a "TSSOP" (Thin Shrink Small Outline Package) or similar surface-mount package. Specific details may vary based on the manufacturer, so it's advisable to consult the manufacturer's datasheet for precise information.
Manufacturer
The part number 52885-1274 is manufactured by Kawasaki Heavy Industries, Ltd. Kawasaki is a diversified multinational corporation based in Japan, known for its extensive range of products, including motorcycles, all-terrain vehicles, industrial equipment, aerospace components, and more. The company operates in various sectors, including transportation, energy, and manufacturing, making it a significant player in both consumer and industrial markets. Kawasaki's reputation is built on innovation, quality engineering, and a commitment to sustainability across its diverse product lines.
Application
The application areas of 52885-1274, also known as 52885, include various sectors such as telecommunications, automotive, and industrial electronics. It is commonly used in the development of integrated circuits, sensors, and communication devices. Additionally, it may find applications in consumer electronics, data transmission, and signal processing technologies.
Equivalent
The 52885-1274 chip is equivalent to the following products:
- 52885-1274 (OEM version)
- 52885-1274A
- 52885-1274B
- Various compatible third-party chips may also be available depending on the specific function desired. Always verify specifications to ensure compatibility.
- 52885-1274 (OEM version)
- 52885-1274A
- 52885-1274B
- Various compatible third-party chips may also be available depending on the specific function desired. Always verify specifications to ensure compatibility.
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