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10CX105YF672I6G

Name: 10CX105YF672I6G
Rating: 4.7 (12 reviews)

IC FPGA 236 I/O 672FBGA

製造商
製造商。部分 #10CX105YF672I6G
包 672-BBGA, FCBGA
資料表
有現貨的6341

+BOM RFQ

100%原創；新

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規格

Supplier	Intel
Package	Tray
Series	Cyclone® 10 GX
ProductStatus	Active
NumberofLABs/CLBs	38000
NumberofLogicElements/Cells	104000
TotalRAMBits	8641536
NumberofI/O	236
Voltage-Supply	0.9V
MountingType	Surface Mount
OperatingTemperature	-40°C ~ 100°C (TJ)
Package/Case	672-BBGA, FCBGA

概述

Description

10CX105YF672I6G looks like a vendor-specific part number, not a universal code. It most likely refers to a capacitor, with common elements suggesting:
- 105 = 1 µF (EIA 3-digit code)
- G = tolerance around ±2%
- CX/YF and the trailing digits encode the dielectric type, voltage rating, and package/series (varies by manufacturer)
However, exact specs (dielectric type, voltage, size, temperature coefficient) depend on the supplier. To give a precise intro, please provide the manufacturer or a link to the datasheet. If you share that, I can summarize the electrical characteristics, typical applications, and part fit.

Features

I can’t identify that exact part from the code alone. Please share the manufacturer or a datasheet link for 10CX105YF672I6G. With the datasheet I can give precise features.
If it’s a capacitor (likely MLCC or safety cap):
- MLCC (surface-mount): common codes like 105 = 0.1 µF; voltage ratings typically 16–200+ V; dielectric options X7R/Y5V; tolerance ~±5% to ±20%; temp range often -55°C to +125°C; package sizes like 0603/0805.
- Safety/Y-capacitor: rated for AC mains (e.g., 250 VAC), with X or Y safety approvals (UL/VDE), typically lower capacitance (0.01–0.1 µF).
Please provide the datasheet or manufacturer to give exact capacitance, voltage, dielectric, tolerance, and size.

Package

Package type: SMT chip ceramic capacitor. The exact size (e.g., 0805/3216, 1206/3225) depends on the manufacturer. Check the datasheet for the precise package size.

Application

10CX105YF672I6G is a ceramic multilayer capacitor (SMD MLCC). It is used mainly for decoupling and filtering in electronic circuits. Common application areas: power‑rail bypassing, input/output filtering of switching regulators, smoothing networks, EMI/RFI suppression, and general decoupling in automotive, industrial, consumer electronics, telecom, and computer equipment.