DO-219AD

其他套餐

• 16-XFBGA, WLCSP
• PowerPAK® ChipFET™ Dual
• SOT-227-4
• 2AG, 5mm x 15mm (Axial)
• 169-BGA
• 56-UFQFN Exposed Pad
• 10-PowerUDFN
• 16-LSSOP (0.173, 4.40mm Width)
• 25-WFLGA
• 26-CDIP Module
• 363-FBGA, FCBGA
• TO-206AC, TO-52-3 Metal Can
• 44-BFLGA
• 32-DIP Module (0.600, 15.24mm)
• DO-200AC, K-PUK